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Master Bond adhesives

Oxygen-free Electronic Copper (OFE), UNS C10100, H08 Temper, wire
Categories: Metal; Nonferrous Metal; Copper Alloy; Wrought Copper

Material Notes: Test specimen: wire, 2 mm diam, H08 temper.

Applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass-to-metal seals, coaxial cables, klystrons, microwave tubes, and rectifiers.

Processing: Excellent hot and cold workability; good forgeability. Fabricated by bending, coining, coppersmithing, drawing and upsetting, hot forging and pressing, knurling, roll threading, shearing, spinning, swaging, and stamping.

Corrosion Resistance: Good to excellent. Susceptible to galvanic corrosion when coupled with iron, aluminum, magnesium, lead, tin, and zinc. Good resistance to atmospheric, brackish water, sea water, and non-oxidizing acid corrosion, but avoid heating in oxidizing atmospheres or exposing to oxidizing acids, moist halogens, sulfides, ammonia, or solutions with ammonium ions.

UNS C10100 - ASTM B1, B2, B3, F68; 101A (Australia); C110 (UK); CDA 101 OFE; ISO Cu-OFE; JIS C1011 H3510 (Japan); QQ-C-502

Key Words: ASTM B1, B2, B3, F68, AS 101A 1567 (Australia), JIS C1011 H3510, C103 , ISO Cu-OFE, CEN CW009A, oxygen-free high conductivity copper (OFHC), CDA 101 OFE
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Physical PropertiesMetricEnglishComments
Density 8.94 g/cc0.323 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 455 MPa66000 psi
Elongation at Break 1.5 %1.5 %in 1500 mm (60 in).
Modulus of Elasticity 115 GPa16700 ksi
Poissons Ratio 0.310.31
Machinability 20 %20 %UNS C36000 (free-cutting brass) = 100%
Forgeability 65 %65 %UNS C37700 (forging brass) = 100%
Shear Modulus 44.0 GPa6380 ksi
Shear Strength 230 MPa33400 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000171 ohm-cm
@Temperature 20.0 °C
0.00000171 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear  17.0 µm/m-°C
@Temperature 20.0 - 100 °C
9.44 µin/in-°F
@Temperature 68.0 - 212 °F
 17.3 µm/m-°C
@Temperature 20.0 - 200 °C
9.61 µin/in-°F
@Temperature 68.0 - 392 °F
 17.7 µm/m-°C
@Temperature 20.0 - 300 °C
9.83 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C
@Temperature 20.0 °C
0.0920 BTU/lb-°F
@Temperature 68.0 °F
Thermal Conductivity 391 W/m-K
@Temperature 20.0 °C
2710 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
Melting Point 1083 °C1981 °F
Annealing Point >= 371 °C>= 700 °F
 
Processing PropertiesMetricEnglishComments
Annealing Temperature 375 - 650 °C707 - 1200 °F
Hot-Working Temperature 750 - 875 °C1380 - 1610 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu >= 99.99 %>= 99.99 %

References for this datasheet.

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MC10100b9 / 10353

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