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Ensinger PEI

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Ensinger TECACOMP LCP LDS black 1049426 Liquid crystal polymer
Categories: Polymer; Thermoplastic; Liquid Crystal Polymer (LCP); Liquid Crystal Polymer (LCP), Unfilled

Material Notes:
  • developed for the LPKF-LDS® process
  • very low melt viscosity
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption
Target Industries:
  • automotive industry
  • electrical engineering
  • LED lighting technology
  • mechanical engineering

Information provided by Ensinger Inc.

Vendors: Ensinger TECACOMP compounds withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesOriginal ValueComments
Density 1.74 g/cc
Water Absorption at Saturation <= 0.10 %50 % relative humidity up to saturation; DIN EN ISO 62
Linear Mold Shrinkage, Flow 0.00030 cm/cmDIN EN ISO 294-4
Linear Mold Shrinkage, Transverse 0.0056 cm/cmDIN EN ISO 294-4
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 85.0 MPaDIN EN ISO 527-1
Elongation at Break 1.6 %DIN EN ISO 527-1
Modulus of Elasticity 9.60 GPaDIN EN ISO 527-1
Charpy Impact Unnotched 15.0 kJ/m²DIN EN ISO 179-1eU
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+17 ohm-cmDIN EN 61340-2-3
Surface Resistance 1.00e+15 ohmDIN EN 61340-2-3
Dielectric Constant 3.5
@Frequency 1e+9 Hz
Dissipation Factor 0.0052
@Frequency 1e+9 Hz
Comparative Tracking Index 150 VDIN EN 60112
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 8.00 µm/m-°C
@Temperature 50.0 - 100 °C
DIN EN ISO 11359-1;2
 11.0 µm/m-°C
@Temperature 100 - 150 °C
DIN EN ISO 11359-1;2
 13.0 µm/m-°C
@Temperature 200 - 250 °C
DIN EN ISO 11359-1;2
 14.0 µm/m-°C
@Temperature 150 - 200 °C
DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow 34.0 µm/m-°C
@Temperature 50.0 - 100 °C
DIN EN ISO 11359-1;2
 44.0 µm/m-°C
@Temperature 100 - 150 °C
DIN EN ISO 11359-1;2
 53.0 µm/m-°C
@Temperature 150 - 200 °C
DIN EN ISO 11359-1;2
 64.0 µm/m-°C
@Temperature 200 - 250 °C
DIN EN ISO 11359-1;2
Thermal Conductivity 0.500 W/m-Kthrough-plane; ISO 22007-4:2008
 2.10 W/m-Kin-plane; ISO 22007-4:2008
Melting Point 310 °CDIN 53765
Maximum Service Temperature, Air 200 °Clong term
 260 °Cshort term
Deflection Temperature at 1.8 MPa (264 psi) 221 °CISO-R 75 Method A
Flammability, UL94 V-0
@Thickness 3.20 mm
DIN IEC 60695-11-10
 
Processing PropertiesOriginal ValueComments
Processing Temperature 290 - 350 °C
Mold Temperature 90.0 - 130 °C
Drying Temperature 130 - 150 °C
Dry Time 3.00 - 5.00 hour
 
Descriptive Properties
Colorblack

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PENSIO9001 / 318929

Chemically Resistant adhesives

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