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Chemically Resistant adhesives

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Parker Chomerics THERMFLOW™ T454 Phase Change Thermal Interface Material
Categories: Polymer; Film

Material Notes: Description: THERMFLOW™ T454 thermal interface pads are phase change materials specially formulated for use in high performance devices requiring minimum thermal resistance for maximum heat sink performance and component reliability. These pads consist of an electrically non-conductive, dry film that softens at device operating temperatures resulting in “grease-like” performance. THERMAFLOW™ T454 are unsupported free films that can yield very thin bond lines between a hot component and a heat sink or heat plate.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.10 g/ccASTM D792
Thickness 130 micronsASTM D374
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 7.80 W/m-K
@Pressure 0.345 MPa,
Temperature 50.0 °C
ASTM D5470
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -60.0 °C
 
Descriptive Properties
ColorWhite to slightly gray
Phase Transition Temperature43ASTM D3418

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PCHOME345 / 131055

Chemically Resistant adhesives

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