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Park Aerospace Nelco® N7000-1 Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide.

Key Features and Benefits:

  • Polyimide resin chemistry
  • Lead-free assembly compatibility
  • Supports current and previous military and industrial standards
  • Reliable plated-through holes
  • Proven processing and performance

Applications/Qualifications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-Ls
  • Direct Chip Attach
  • High Speed Computing
  • Burn-in Boards

Information provided by Park Electrochemical Corp.

Key Words: PI
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.68 g/cc50% Resin Content; Internal Method
Water Absorption 0.35 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 3900 ksiX; ASTM D3039
 3900 ksiY; ASTM D3039
Poissons Ratio 0.12X; ASTM D3039
 0.12Y; ASTM D3039
Peel Strength 6.00 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 7.00 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 7.50 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.8
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.9
@Frequency 1e+10 Hz
Split Post Cavity
 3.9
@Frequency 1e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
 3.9
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
Dielectric Strength 1350 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.0095
@Frequency 1e+10 Hz
Split Post Cavity
 0.015
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
 0.016
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 136 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 8.33 µin/in-°F
@Temperature -40.0 - 125 °C
IPC-TM-650.2.4.41
Glass Transition Temp, Tg 250 °CTMA; IPC-TM-650.2.4.24c
 260 °CDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 389 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.42IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)12+IPC-TM-650.2.4.24.1
Z Axis Expansion (%)1.850ºC to 260ºC; IPC-TM-650.2.4.41

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