The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide. Key Features and Benefits: - Polyimide resin chemistry
- Lead-free assembly compatibility
- Supports current and previous military and industrial standards
- Reliable plated-through holes
- Proven processing and performance
Applications/Qualifications: - Fine-Line Multilayers
- Backplanes
- Surface-Mount Multilayers
- BGA Multilayers
- MCM-Ls
- Direct Chip Attach
- High Speed Computing
- Burn-in Boards
Information provided by Park Electrochemical Corp. |