MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Specialty Compounds RTP Company

(Viewing data as-entered. Click here to return)
Park Aerospace Nelco® N7000-1 Polyimide Laminate and Prepreg
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide.

Key Features and Benefits:

  • Polyimide resin chemistry
  • Lead-free assembly compatibility
  • Supports current and previous military and industrial standards
  • Reliable plated-through holes
  • Proven processing and performance

Applications/Qualifications:

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • MCM-Ls
  • Direct Chip Attach
  • High Speed Computing
  • Burn-in Boards

Information provided by Park Electrochemical Corp.

Key Words: PI
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.68 g/cc50% Resin Content; Internal Method
Water Absorption 0.35 %IPC-TM-650.2.6.2.1
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 3900 ksiX; ASTM D3039
 3900 ksiY; ASTM D3039
Poissons Ratio 0.12X; ASTM D3039
 0.12Y; ASTM D3039
Peel Strength 6.00 pliat elevated temperature; IPC-TM-650.2.4.8.2a
 7.00 pliafter exposure to process solutions; IPC-TM-650.2.4.8
 7.50 pliafter solder float; IPC-TM-650.2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+13 ohm-cmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohm-cmE - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+13 ohmC - 96/35/90; IPC-TM-650.2.5.17.1
 1.00e+13 ohmE - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 3.8
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
 3.9
@Frequency 1e+10 Hz
Split Post Cavity
 3.9
@Frequency 1e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
 3.9
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
Dielectric Strength 1350 V/milIPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 VIPC-TM-650.2.5.6
Dissipation Factor 0.0095
@Frequency 1e+10 Hz
Split Post Cavity
 0.015
@Frequency 2.50e+9 Hz
Stripline; IPC-TM-650.2.5.5.5
 0.016
@Frequency 1e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
Arc Resistance 136 secIPC-TM-650.2.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.67 - 8.33 µin/in-°F
@Temperature -40.0 - 125 °C
IPC-TM-650.2.4.41
Glass Transition Temp, Tg 250 °CTMA; IPC-TM-650.2.4.24c
 260 °CDSC; IPC-TM-650.2.4.25c
Decomposition Temperature 389 °C5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
 
Descriptive Properties
Methylene Chloride Resistance (% Weight Change)0.42IPC-TM-650.2.3.4.3
Pressure CookerPass60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)12+IPC-TM-650.2.4.24.1
Z Axis Expansion (%)1.850ºC to 260ºC; IPC-TM-650.2.4.41

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

Users viewing this material also viewed the following:
Park Aerospace Nelco® N7000-2 HT/N7000-3 Toughened Polyimide Laminate and Prepreg
Hippe PI
Ensinger TECASINT 4041 Polyimide, Glossy Black, Molybdenum Sulfide (PI)
Ensinger TECASINT 4021 Polyimide, Black, 15% Graphite (PI)
Ensinger TECASINT 4011 Polyimide, Yellow (PI)

PPARK121 / 89393

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at info@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.