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Hexcel® HexPEKK® 100 for LPBF Printing
Categories: Polymer; 3D Printing/Additive Manufacturing Polymer; Thermoplastic; Polyketone; PEKK, Unreinforced

Material Notes: Description: HexPEKK®-100 is an electrostatic dissipative material developed for additive manufacturing with laser powder bed fusion (LPBF) technology. HexPEKK®-100 is highly chemically resistant and low-outgassing, with a wide service temperature range. Compliance to FAR 25.853 flammability, smoke and toxicity puts HexPEKK®-100 at the core of aerospace requirements and parts are currently in use for commercial aviation, crewed space, satellite, military aviation, and defense applications. Combining the flexibility of laser powder bed fusion technology with an engineering grade material 50% lighter than aluminum, HexPEKK®-100 is the perfect solution for your aerospace needs.

Information provided by Hexcel Corporation.

Vendors:
Proto3000 provides design tools, 3D printers, additive manufacturing processes, metrology technologies, high-performance materials, and part-finishing automation. Our ISO 9001:2015 additive manufacturing production facility offers 3D printing services, rapid prototyping services, and end-part production with HP MultiJet Fusion (MJF), FDM, SLA, SLS, Polyjet, DLP, metal binder jetting, BMD, and DMLS.

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Physical PropertiesOriginal ValueComments
Density 1.31 g/ccASTM D792
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 25.9 MPa
@Temperature 149 °C
ETW, Z
 31.7 MPa
@Temperature 149 °C
ETW, X
 44.5 MPa
@Temperature 121 °C
ETW, Z
 57.3 MPa
@Temperature 121 °C
ETW, X
 65.9 MPa
@Temperature 82.2 °C
ETW, Z
 70.3 MPa
@Temperature 22.2 °C
RTA, Z
 75.1 MPa
@Temperature -184 °C
CTD, Z
 75.8 MPa
@Temperature -53.9 °C
CTD, Z
 85.7 MPa
@Temperature 82.2 °C
ETW, X
 101.4 MPa
@Temperature -184 °C
CTD, X
 111.3 MPa
@Temperature 22.2 °C
RTA, X
 116.5 MPa
@Temperature -53.9 °C
CTD, X
Elongation at Break 1.20 %
@Temperature -184 °C
CTD, Z
 1.30 %
@Temperature -184 °C
CTD, X
 1.70 %
@Temperature -53.9 °C
CTD, Z
 1.80 %
@Temperature 22.2 °C
RTA, Z
 2.00 %
@Temperature -53.9 °C
CTD, X
 2.00 %
@Temperature 82.2 °C
ETW, Z
 2.40 %
@Temperature 22.2 °C
RTA, X
 2.90 %
@Temperature 82.2 °C
ETW, X
 3.60 %
@Temperature 121 °C
ETW, Z
 6.40 %
@Temperature 121 °C
ETW, X
 13.0 %
@Temperature 149 °C
ETW, Z
 23.5 %
@Temperature 149 °C
ETW, X
Tensile Modulus 1.441 GPa
@Temperature 149 °C
ETW, Z
 1.758 GPa
@Temperature 149 °C
ETW, X
 4.068 GPa
@Temperature 121 °C
ETW, Z
 4.364 GPa
@Temperature 82.2 °C
ETW, Z
 4.654 GPa
@Temperature 22.2 °C
RTA, Z
 4.999 GPa
@Temperature -53.9 °C
CTD, Z
 5.58 GPa
@Temperature 121 °C
ETW, X
 6.143 GPa
@Temperature 82.2 °C
ETW, X
 6.563 GPa
@Temperature 22.2 °C
RTA, X
 6.936 GPa
@Temperature -184 °C
CTD, Z
 6.95 GPa
@Temperature -53.9 °C
CTD, X
 8.074 GPa
@Temperature -184 °C
CTD, X
Flexural Strength 111 MPaZ, 4-point; ASTM D790
 162 MPaX, 4-point; ASTM D790
Flexural Modulus 4.64 GPaZ, 4-point; ASTM D790
 5.54 GPaX, 4-point; ASTM D790
Flexural Strain at Break 2.50 %Z, 4-point; ASTM D790
 3.30 %X, 4-point; ASTM D790
Compressive Strength 172 MPaZ, 2% Offset Yield; ASTM D695
 184 MPaX, 2% Offset Yield; ASTM D695
Compressive Modulus 5170 MPaZ; ASTM D695
 5860 MPaX; ASTM D695
Poissons Ratio 0.330Z; ASTM D638
 0.370X; ASTM D638
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 1.00e+11 ohm-cmASTM D257
 
Thermal PropertiesOriginal ValueComments
CTE, linear 19.3 µin/in-°F
@Temperature 30.0 - 150 °C
ASTM E831
 32.9 µin/in-°F
@Temperature 30.0 - 150 °C
ASTM E831
Thermal Conductivity 0.320 W/m-KX; ASTM D7984
 0.370 W/m-KX; ASTM D7984
 0.390 W/m-KZ; ASTM D7984
 0.470 W/m-KZ; ASTM D7984
Melting Point 300 °CASTM D3418
Maximum Service Temperature, Air 149 °C
Deflection Temperature at 0.46 MPa (66 psi) 277.4 °CASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 184.9 °CASTM D648
Minimum Service Temperature, Air -184 °C
Glass Transition Temp, Tg 160 °CASTM D3418

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PHEXCB9599 / 322753

Proto3000 – 3D Engineering Solutions

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