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Chemically Resistant adhesives

Epoxies, Etc 20-2101 Polyurethane Potting & Encapsulating Resins
Categories: Polymer; Thermoset; Silicone

Material Notes: Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80.

Green: The base Natural Oil Polyol (NOP) used in these systems is obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.

Features:

  • Green
  • Low Viscosity
  • Available in TriggerBond
  • Low Durometer
  • Moisture Resistant
  • Convenient Mix Ratios
  • Low Shrinkage & Exotherm
Benefits:
  • Reduce demand on non-renewable fossil fuels
  • Quick self leveling around components
  • Easy to use packaging
  • Low stress on components & vibration resistant
  • Can be used in wet environments
  • Easy to process by hand or with meter mix
  • Less stress to components during cure

Information provided by Epoxies, Etc

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Physical PropertiesMetricEnglishComments
Specific Gravity 0.970 g/cc0.970 g/ccPolyol Resin
 1.15 g/cc1.15 g/ccIsocyanate
Viscosity 1500 cP1500 cPPolyol Resin
 1600 cP1600 cPMixed
 2000 cP2000 cPIsocyanate
Storage Temperature 21.0 - 29.0 °C69.8 - 84.2 °F
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cm
Dielectric Constant 4.0
@Frequency 1000 Hz
4.0
@Frequency 1000 Hz
Dielectric Strength 24.6 kV/mm625 kV/in
Dissipation Factor 0.017
@Frequency 1000 Hz
0.017
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 200 µm/m-°C111 µin/in-°F
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 125 °C257 °F
Minimum Service Temperature, Air -30.0 °C-22.0 °F
 
Processing PropertiesMetricEnglishComments
Gel Time 20.0 min20.0 min
 
Descriptive Properties
ColorClear
Mix Ratio1:4Iso:Polyol, by volume
 25:100Iso:Polyol, by weight

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PFEPOX010 / 316687

Chemically Resistant adhesives

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