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Master Bond adhesives

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Mitsubishi Chemical Advanced Materials Semitron™ CMP XL20 PAI
Categories: Polymer; Thermoplastic; Polyamide-imide (PAI)

Material Notes: Semitron™ CMP XL20 was developed from a proprietary polyamide-base resin and offers the best combination of wear life, and mechanical strength and stiffness, ideal for the most demanding applications and in extreme process environments..

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.40 g/ccASTM D792
Water Absorption at Saturation 1.70 %ASTM D570 (17)
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square 1.00e+14 ohmANSI/ESD STM 11.11
Dielectric Constant 4.20
@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 580 kV/inASTM D149
Dissipation Factor 0.0260
@Frequency 1.00e+6 Hz
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µin/in-°FASTM E-831 (TMA)
Thermal Conductivity 1.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 500 °FContinuous Use Temperature in Air after 20000 hr
Deflection Temperature at 1.8 MPa (264 psi) 532 °FASTM D648
Glass Transition Temp, Tg 527 °FDMA- Tan d
 
Chemical Resistance PropertiesOriginal ValueComments
Acids, Strong (pH 1-3) Limited
Acids, Weak Acceptable
Alcohols Acceptable
Alkalies, Strong (pH 11-14) Unacceptable
Alkalies, Weak Limited
Chlorinated Solvents Acceptable
Continuous Sunlight Acceptable
Hot Water / Steam Limited
Hydrocarbons - Aliphatic Acceptable
Hydrocarbons - Aromatic Acceptable
Inorganic Salt Solutions Acceptable
Ketones, Esters Acceptable
 
Descriptive Properties
ESd categoryInsulative

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P1SM34e / 89258

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