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Metal adhesives

Master Bond EP4UF-80 One component flowable epoxy for bonding and underfill applications
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Master Bond EP4UF-80 is a one component, low viscosity epoxy primarily for underfill applications, that can also be used as an adhesive. It has good flow properties and will cure at elevated temperatures with a minimum of 80°C. It is not premixed and frozen and has unlimited working life at room temperature. Curing is simple and straightforward; 30-60 minutes at 80-85°C, or 15-30 minutes at 90-95°C. EP4UF-80 has a thermally conductive, electrically insulative filler material with ultra small particle sizes. This allows EP4UF- 80 to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP4UF-80 has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing. EP4UF-80 is a highly useful thermally conductive adhesive. It bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. Because the particles are so small, it can be applied in thin bond sections. This, in effect, lowers the thermal resistance and increases the heat transfer properties of the system. For example, with a typical thermally conductive filler, a reasonable bond line thickness is about 50 microns. In this scenario, the thermal resistance would be 50-100 x 10-6 K•m2/W. However, when an epoxy such as EP4UF-80 is applied, the thin bond line lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat related issues. EP4UF-80 will resist waters, oils and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The system is a highly effective thermal interface material for bonding and underfill applications in microelectronic packaging and assembly.

Product Advantages:

  • Single component; no mixing needed
  • Unlimited working life at room temperature
  • Rapid curing with versatile cure schedules
  • Can be used as an underfill for very tight spaces
  • Small particle size lowers thermal resistance
Key Features:
  • Thermally conductive, electrically insulating
  • Ultra fine particle size
  • Low viscosity and good flow
  • NASA low outgassing

Information provided by Master Bond.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.49 g/cc1.49 g/cc
Solids Content 100 %100 %
Viscosity 500 - 1500 cP500 - 1500 cP
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 85 - 9585 - 95
Tensile Strength 34.5 - 48.3 MPa5000 - 7000 psi
Elongation at Break 1.0 - 3.0 %1.0 - 3.0 %
Tensile Modulus 6.21 - 7.58 GPa900 - 1100 ksi
Compressive Strength 124 - 138 MPa18000 - 20000 psi
Adhesive Bond Strength 8.96 - 10.3 MPa1300 - 1500 psiTensile lap shear, Al to Al
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+14 ohm-cm>= 1.00e+14 ohm-cm
Dielectric Constant 4.4
@Frequency 60 Hz
4.4
@Frequency 60 Hz
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 0.648 - 0.749 W/m-K4.50 - 5.20 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -50.0 °C-58.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  15.0 - 30.0 min
@Temperature 90.0 - 95.0 °C
0.250 - 0.500 hour
@Temperature 194 - 203 °F
 30.0 - 60.0 min
@Temperature 80.0 - 85.0 °C
0.500 - 1.00 hour
@Temperature 176 - 185 °F
Shelf Life 3.00 - 6.00 Month
@Temperature -40.0 °C
3.00 - 6.00 Month
@Temperature -40.0 °F

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PMASTM631 / 268819

Metal adhesives

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