Epoxy Technology EPO-TEK® OD1001 Thermally and Electrically Insulating Epoxy

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Epoxy Technology EPO-TEK® OD1001 Thermally and Electrically Insulating Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Material Description: A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device plastic packaging. Information Provided by Epoxy Technology
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Physical Properties	Original Value	Comments

Specific Gravity	1.13 g/cc
Particle Size	<= 10 µm
Viscosity	1000 - 1500 cP @Temperature 23.0 °C	100 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	70
Tensile Modulus	169000 psi	Storage
Shear Strength	>= 1800 psi	Lap
	>= 5100 psi	Die

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 2.00e+13 ohm-cm
Dielectric Constant	3.05 @Frequency 1000 Hz
Dissipation Factor	0.011 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	66.0 µm/m-°C	Below Tg
	211 µm/m-°C	Above Tg
Maximum Service Temperature, Air	175 °C	Continuous
	275 °C	Intermittent
Minimum Service Temperature, Air	-55.0 °C	Continuous
	-55.0 °C	Intermittent
Glass Transition Temp, Tg	>= 35.0 °C	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature	355 °C	Degradation Temperature

Optical Properties	Original Value	Comments
Refractive Index	1.5413 @Wavelength 589 nm
Transmission, Visible	<= 50 % @Wavelength 300 - 1200 nm	Spectral

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 125 °C	minimum
Pot Life	40320 min
Shelf Life	12.0 Month @Temperature -40.0 °C

Descriptive Properties
Color	Cream
Consistency	Smooth thin paste
Number of Components	Single
Weight Loss	0.27%	200°C
	0.64%	250°C
	1.5%	300°C

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PPOXYT136 / 141175

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