Appearance: Silver Product Benefits: - Excellent hot/wet adhesion
- Excellent peel strength
- Improved JEDEC performance
- Low moisture absorption
- Ideal modulus for wide range of package sizes
Cure: Heat cureApplication: Die attach Key Substrates: PPF, Bare Copper and Ag plated Cu leadframes LOCTITE ABLESTIK 8302 electrically conductive die attach adhesive is designed for high reliability package applications Information provided by Loctite® |