Resin Technology Group TIGA R-915 Versatile, Rigid, High Thermal Conductivity Bonding System

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Resin Technology Group TIGA R-915 Versatile, Rigid, High Thermal Conductivity Bonding System
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	100 parts resin to 9.5 parts hardener. TIGA R-915 is a medium viscosity versatile epoxy bonding system that exhibits unusually high thermal conductivity and low thermal expansion. It is recommended for electronic/electrical bonding and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal expansion coefficients, thermal shock resistance, high heat transfer capabilities and outstanding electrical properties. Fully cured TIGA R-915 is highly resistant to weather, water, gases and vapors, petroleum lubricants and fuels and many mild acids and alkalis. Information provided by Resin Technology Group.
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Physical Properties	Original Value	Comments

Specific Gravity	2.20 g/cc
Viscosity	1000 cP @Temperature 25.0 °C	Mixed

Mechanical Properties	Original Value	Comments
Hardness, Shore D	90
Tensile Strength at Break	>= 7000 psi
Compressive Strength	>= 14000 psi

Electrical Properties	Original Value	Comments
Dielectric Strength	>= 400 V/mil
Dissipation Factor	0.0024 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
Thermal Conductivity	10.1 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-40.0 °C

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 130 °C
	2.00 hour @Temperature 100 °C

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PRESINT607 / 65491

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