Hapco DI-PAK™ R-4528/7 Potting and Encapsulating Compound

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Hapco DI-PAK™ R-4528/7 Potting and Encapsulating Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A black, flame retardant, thermally conductive, high performance series that can be used in all types of electrical components. Combined with its ability to dissipate heat, DI-PAK™ R-4528 also provides low linear thermal expansion, low shrinkage, and low exothermic heat while curing. Meets UL requirements. Information provided by Hapco, Inc.
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Physical Properties	Original Value	Comments

Specific Gravity	1.69 g/cc	ASTM D-4669
Viscosity	24000 cP	ASTM D-4878
Linear Mold Shrinkage	0.00050 - 0.0010 in/in	ASTM D-2566

Mechanical Properties	Original Value	Comments
Hardness, Shore D	95	ASTM D-2240
Tensile Strength	7000 psi	ASTM D-638
Elongation at Break	0.60 %	ASTM D-638
Modulus of Elasticity	350 ksi	ASTM D-638
Flexural Strength	7800 psi	ASTM D-790
Flexural Modulus	386 ksi	ASTM D-790
Izod Impact, Notched	0.410 ft-lb/in	ASTM D-256
Izod Impact, Unnotched	0.620 ft-lb/in	ASTM D-256

Electrical Properties	Original Value	Comments
Volume Resistivity	7.50e+13 ohm-cm	ASTM D-270
Dielectric Constant	4.4 @Frequency 100000 Hz	ASTM D-150
	4.6 @Frequency 1000 Hz	ASTM D-150
Dielectric Strength	421 V/mil	ASTM D-149
Dissipation Factor	0.0090 @Frequency 100000 Hz	ASTM D-150

Thermal Properties	Original Value	Comments
Thermal Conductivity	2.90 BTU-in/hr-ft²-°F
Maximum Service Temperature, Inert	163 °C

Processing Properties	Original Value	Comments
Cure Time	16.0 - 24.0 hour @Thickness 3.17 mm	Demold
	2.00 - 4.00 hour @Thickness 3.17 mm, Temperature 65.6 °C	Demold
Gel Time	50.0 min @Load 0.100 kg	ASTM D-2971

Descriptive Properties
Color (cured)	Black
Mix Ratio	100:10	Volume
	100:6	Weight

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PHAPCO037 / 317096

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