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Chemically Resistant adhesives

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Parker Chomerics THERMFLOW® T557 Non-Silicone, Phase-Change Thermal Interface Pad
Categories: Polymer

Material Notes: Description: THERMFLOW® phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronics components and heat sinks. This low thermal resistance path maximizes heat sink performance and improves component reliability. At room temperature, THERMFLOW® materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW® material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERFLOW® pads to achieve performance superior to any other thermal interface materials. THERMFLOW® products are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly. p>Typical Applications: Microprocessors; Graphics Processors; Chipset; Memory Modules; Power Modules and Power Semiconductors

Product Attributes: Superior thermal performance; For attachment remove white release liner first; Dispersed solder filler offers added thermal performance; Resin system designed for higher temperature reliability; Inherently tack – no adhesive required and Tabs available for easy removal

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.40 g/ccASTM D792
Thickness 125 micronsASTM D374
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 9.62 W/m-K
@Pressure 0.0690 MPa
ASTM D5470
 12.89 W/m-K
@Pressure 0.172 MPa
ASTM D5470
 24.04 W/m-K
@Pressure 0.345 MPa
ASTM D5470
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Shelf Life 12.0 MonthFrom date of manufacture; Chomerics
 
Descriptive Properties
ColorGray
Phase Transition Temperature45Polymer; ASTM D3418
 62Low melting alloy filler; ASTM D3418
Weight Loss<0.5%125°C for 48 hours

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PCHOME342 / 131052

Chemically Resistant adhesives

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