Epoxies, Etc 20-3035, Cat. 140 Low Density Epoxy Potting Compound

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Epoxies, Etc 20-3035, Cat. 140 Low Density Epoxy Potting Compound
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Description: 20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. In addition to the standard bulk packaging, 20-3035 can be supplied in the ready-to-use FreezeBond® premixed and frozen syinges for elimination of waste and consistent quality. Features: Low Dielectric Constant Low Coefficient of Thermal Expansion Low Shrinkage Low Density Excellent Moisture Resistance Information provided by Epoxies, Etc
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	0.840 g/cc
Water Absorption	0.40 % @Time 86400 sec
Viscosity	5000 cP	Mixed
Linear Mold Shrinkage	0.0010 in/in

Mechanical Properties	Original Value	Comments
Hardness, Shore D	78
Tensile Strength	4300 psi
Flexural Strength	5000 psi
Compressive Strength	10000 psi

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+13 ohm-cm
Dielectric Constant	2.9 @Frequency 1e+6 Hz
Dielectric Strength	375 V/mil
Dissipation Factor	0.050 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
CTE, linear	43.0 µm/m-°C
Thermal Conductivity	0.190 W/m-K
Maximum Service Temperature, Air	105 °C
Minimum Service Temperature, Air	-65.0 °C

Processing Properties	Original Value	Comments
Cure Time	2.00 - 3.00 hour @Temperature 100 °C
	2.00 - 4.00 hour @Temperature 85.0 °C
Pot Life	30.0 min @Load 0.100 kg

Descriptive Properties
Mix Ratio	100:23	by weight (Resin: Catalyst)

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PFEPOX029 / 316706

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message