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Chemically Resistant adhesives

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Parker Chomerics CHO-SEAL 1350 Conductive Elastomer
Categories: Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone

Material Notes: Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.

RoHS Compliant

Information provided by Chomerics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.65 - 2.15 g/ccASTM D792
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 58 - 72ASTM D2240
Tensile Strength at Break >= 200 psiASTM D412
Elongation at Break 100 - 300 %ASTM D412
Tear Strength 5.250 kN/mASTM D624
Compression Set >= 30 %
@Temperature 100 °C,
Time 252000 sec
ASTM D395 Method B
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.010 ohm-cmas supplied without pressure sensitive adhesive; MIL-DTL-83528
 0.010 ohm-cmPost Tensile Set; MIL-DLT-83528 Para.4.6.9
Shielding Effectiveness >= 100 dB100 MHz (E Field); MIL-G-83528
 >= 50 dB
@Frequency 200000 Hz
H Field; MIL-DTL-83528 Para.4.6.12
 >= 75 dB
@Frequency 4.00e+10 Hz
Plane Wave; MIL-DTL-83528 Para.4.6.12
 >= 80 dB
@Frequency 1e+10 Hz
Plane Wave; MIL-DTL-83528 Para.4.6.12
 >= 90 dB
@Frequency 2.00e+9 Hz
Plane Wave; MIL-DTL-83528 Para.4.6.12
 >= 100 dB
@Frequency 1e+8 Hz
E Field; MIL-DTL-83528 Para.4.6.12
 >= 100 dB
@Frequency 5.00e+8 Hz
E Field; MIL-DTL-83528 Para.4.6.12
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 1.20 W/m-K
@Pressure 2.07 MPa
ASTM D5470
Maximum Service Temperature, Air 160 °C
Minimum Service Temperature, Air -55.0 °CFlex TR10; ASTM D1329
 
Descriptive Properties
BinderSilicone
FillerAg/Glass
Heat Aging ohm-cm max0.01
TypeMMIL-DTL-83528

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PCHOME109 / 28331

Chemically Resistant adhesives

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