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Master Bond adhesives

Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optical industries.

Advantages & Application Notes:

  • Thixotropic nature provides a non-sag adhesive, with wet green strength prior to cure.
  • Color change from tan to amber upon successful cure.
  • Versatile adhesive to most plastics, ceramics, metals, and glass.
  • Suggested Applications:
    • PCB; Staking SMD devices to the PCB for double-sided assembly.
    • Bonding of ferrites for power-devices.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.02 g/cc1.02 g/ccPart A
 1.12 g/cc1.12 g/ccPart B
Particle Size <= 20 µm<= 20 µm
Viscosity 9000 - 15000 cP
@Temperature 23.0 °C
9000 - 15000 cP
@Temperature 73.4 °F
20 rpm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8080
Tensile Modulus 3.8550 GPa559.12 ksiStorage
Shear Strength 13.47 MPa1953 psiLap
 >= 35.2 MPa>= 5100 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 4.00e+12 ohm-cm>= 4.00e+12 ohm-cm
Dielectric Constant 3.21
@Frequency 1000 Hz
3.21
@Frequency 1000 Hz
Dissipation Factor 0.0030
@Frequency 1000 Hz
0.0030
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 43.0 µm/m-°C23.9 µin/in-°FBelow Tg
 231 µm/m-°C128 µin/in-°FAbove Tg
Maximum Service Temperature, Air 225 °C437 °FContinuous
 325 °C617 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 90.0 °C>= 194 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 399 °C750 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time  1.00 min
@Temperature 150 °C
0.0167 hour
@Temperature 302 °F
minimum
 5.00 min
@Temperature 120 °C
0.0833 hour
@Temperature 248 °F
minimum
 10.0 min
@Temperature 100 °C
0.167 hour
@Temperature 212 °F
minimum
Pot Life 180 min180 min
Shelf Life 12.0 Month
@Temperature 23.0 °C
12.0 Month
@Temperature 73.4 °F
 
Descriptive Properties
ColorAmberPart B
 TanPart A
ConsistencySmooth Thixotropic paste
Mix Ratio by Weight10:1
Number of ComponentsTwo
Weight Loss0.02%200°C
 0.45%250°C
 1.46%300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT160 / 141199

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