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Chemically Resistant adhesives

Cookson Group Plaskon® 1031 Conventional Encapsulant  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

A low cost, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.98 g/cc0.0715 lb/in³
Viscosity 13500 cP
@Temperature 175 °C
13500 cP
@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 69.0 - 93.0 cm27.2 - 36.6 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7979
Flexural Strength 131 MPa19000 psi
Flexural Modulus 18.0 GPa2610 ksi
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1000 Hz
3.8
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm406 kV/in
Dissipation Factor 0.0020
@Frequency 1000 Hz
0.0020
@Frequency 1000 Hz
Arc Resistance 180 sec180 sec
 
Thermal PropertiesMetricEnglishComments
CTE, linear 22.0 µm/m-°C
@Temperature 20.0 °C
12.2 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 62.0 µm/m-°C
@Temperature 20.0 °C
34.4 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.800 W/m-K5.55 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 155 °C311 °F
Flammability, UL94  V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 V-0
@Thickness 1.60 mm
V-0
@Thickness 0.0630 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

**
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PCOOK304 / 21400

Chemically Resistant adhesives

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