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Metal adhesives

Master Bond EP21FL Flexibilized and Toughened Low Viscosity Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Key Features:
  • Withstands rigorous thermal cycling
  • Superior durability
  • Low exotherm during cure
  • Long working life
  • Cures at ambient temperatures
  • High strength adhesive, sealant and encapsulant
Product Description: Master Bond EP21FL is a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio by weight. This compound is 100% reactive and does not contain any solvents or volatiles. It bonds well to a variety of substrates, including metals, glass, ceramics and many plastics. Since it is a toughened system, it is ideal for bonding dissimilar substrates with differing coefficients of expansion. EP21FL is effective for bonding surfaces subjected to rigorous thermal cycling as well as thermal and mechanical shocks. EP21FL is a wonderful potting compound, particularly for larger encapsulations. Its excellent electrical insulation properties are especially significant. EP21FL features an exceptionally long working life, along with a low exotherm while curing. It is resistant to chemicals including water, oils, salts, etc., over the wide temperature range of -100°F to +250°F. Part A is transparent and the color of Part B is amber-clear. Master Bond EP21FL is widely used in electronic, electrical, optical and aerospace applications, among others.

Product Advantages:

  • Convenient mixing: four to one ratio by weight
  • Toughened epoxy ideal for bonding dissimilar substrates subjected to rigorous thermal cycling
  • Lower viscosity; easily applied for bonding, coating and encapsulation
  • Versatile cure schedules; ambient temperature cures or faster, elevated temperature cures
  • Low exotherm; appropriate for larger castings
  • Superior durability, thermal shock and chemical resistance
  • Outstanding ability to withstand thermal cycling
  • Excellent electrical insulation properties
  • Exceptionally long working life

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesMetricEnglishComments
Viscosity 500 - 2000 cP500 - 2000 cPPart A
 2000 - 4500 cP2000 - 4500 cPMixed
 10000 - 15000 cP10000 - 15000 cPPart B
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 35 - 4535 - 45
Tensile Strength >= 27.6 MPa>= 4000 psi
Tensile Modulus 1.21 - 1.55 GPa175 - 225 ksi
Adhesive Bond Strength >= 6.89 MPa>= 1000 psiTensile lap, Aluminum to Aluminum
Peel Strength >= 1.75 kN/m>= 10.0 pli
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cm
Dielectric Constant 3.6
@Frequency 60 Hz
3.6
@Frequency 60 Hz
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 121 °C250 °F
Minimum Service Temperature, Air -73.3 °C-100 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 4320 - 7200 min
@Temperature 23.9 °C
72.0 - 120 hour
@Temperature 75.0 °F
Working Life 420 - 480 min420 - 480 minAfter mixing, 100 g batch
Shelf Life 12.0 Month
@Temperature <=23.9 °C
12.0 Month
@Temperature <=75.0 °F
in original, unopened containers
 
Descriptive Properties
Mixing Ratio4:1 by weightParts A to B

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PMASTM821 / 185414

Metal adhesives

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