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Master Bond adhesives

Cookson Group STAYSTIK® Resin E Patented Technology Paste  (discontinued **)
Categories: Polymer; Adhesive; Thermoplastic

Material Notes: This thermoplastic adhesive paste is a solvent based polymer specially developed for temporary bonding applications most typically associated with tape head slider manufacturing but can be used for a variety of applications were temporary adhesion is necessary. This adhesive is commonly debonded in NMP leaving no residue or contamination on the surface of the debonded assembly.

Applications:

  • Wafer lapping
  • Substrate cutting
  • Wafer cutting
  • Wafer polishing
  • Row bonding for dicing
  • Lens polishing

Information provided by Cookson Electronics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Mechanical PropertiesMetricEnglishComments
Adhesive Bond Strength >= 17.2 MPa>= 2500 psi
 
Processing PropertiesMetricEnglishComments
Drying Temperature 70.0 °C158 °FFor 10 minutes, Open face
 
Descriptive Properties
Attach Temperature100-140°C
Dwell Time5-25 seconds
Pressure During Dwell Time0-5 psi

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK057 / 56347

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