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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Lucas-Milhaupt SIL-FOS® 18 Silver/ Copper/ Phosphorus Alloy
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes:

Applications: Sil-Fos 18 is a moderate cost brazing filler metal suitable for joining copper, brass and bronze alloys where low brazing temperature and free flowing characteristics are required. It should be used on assemblies where good fitup can be maintained.

Characteristics: Sil-Fos 18 is a ternary eutectic, low temperature brazing filler metal that is free flowing and self-fluxing on copper and some high copper an copper alloys by virtue of its phosphorus content. Brasses and most bronzes require the use of Handy Flux (or Handy Flux Type A-1 on Aluminum Bronze or Beryllium Copper) for good wetting. This alloy becomes extremely fluid above its melting point. With most joint designs a clearance of .001" to .003" (.025mm.-.075mm) is desirable.

Sil-Fos 18 should not be used on ferrous metals or nickel base alloys, since the phosphorus diffuses and produces brittle iron or nickel phosphides at the joint interface.

Information provided by Lucas-Milhaupt, Inc.

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Physical PropertiesOriginal ValueComments
Density 0.293 lb/in³
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000294 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Melting Point 1190 °F
Solidus 1190 °FMelting Point
Liquidus 1190 °FFlow Point
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu >= 75.15 %
Other, total <= 0.15 %
Phosphorus, P 6.3 - 6.7 %
Silver, Ag 17.2 - 18 %
 
Descriptive Properties
ColorGray

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solder replacement adhesives

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