Henkel Loctite® 3517M Epoxy

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Henkel Loctite® 3517M Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black liquid Product Benefits: One component Reworkable Low halogen content Cure Heat cure Application: Underfill Typical Package Application: CSP, Flip Chip BGA and BGA Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.12 g/cc	Uncured
Density	1.15 g/cc	Uncured
Water Absorption	0.10 % @Time 86400 sec	Cured; ISO 62
Viscosity	2600 cP	Uncured, Shear rate of 36 s-1, HAAKE PK1.2

Mechanical Properties	Original Value	Comments
Hardness, Shore D	87	Cured
Flexural Strength	120 MPa	Cured; ASTM D790
Flexural Modulus	3500 MPa	Cured; ASTM D790
Shear Strength	14.4 MPa	Cured, Lap, Epoxy glass; ISO 4587

Electrical Properties	Original Value	Comments
Volume Resistivity	8.80e+16 ohm-cm	Cured; IEC 60093
Surface Resistance	2.50e+16 ohm	Cured; IEC 60093
Dielectric Constant	3.06 @Frequency 1e+7 Hz	Cured; IEC 60250
	3.1 @Frequency 1e+6 Hz	Cured; IEC 60250
	3.13 @Frequency 100000 Hz	Cured; IEC 60250
Dissipation Factor	0.010 @Frequency 100000 Hz	Cured; IEC 60250
	0.010 @Frequency 1e+6 Hz	Cured; IEC 60250
	0.020 @Frequency 1e+7 Hz	Cured; IEC 60250

Thermal Properties	Original Value	Comments
CTE, linear	65.0 µm/m-°C	Cured, Below Tg
	191 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	78.0 °C	Cured, (Tg) by TMA
	101 °C	Cured, (Tg) by DMTA
Shrinkage	1.4 %	Cured

Processing Properties	Original Value	Comments
Cure Time	5.00 min @Temperature 120 °C
	10.0 min @Temperature 100 °C
Pot Life	7.00 day	Uncured

Descriptive Properties
Flow Rate	1 min 3 s	50 °C, 0.1 mm gap, Glass to Glass, 12.7 mm flow
	4 min 56 s	25 °C, 0.15 mm gap, Glass to Glass, 12.7 mm flow
	53 s	50 °C, 0.15 mm gap, Glass to Glass, 12.7 mm flow
	8 min 49 s	25 °C, 0.1 mm gap, Glass to Glass, 12.7 mm flow

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PLOCT5000 / 255211

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