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solder replacement adhesives

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Lucas-Milhaupt Silvaloy® 600 Silver Based Cadmium Free Filler Metal
Categories: Metal; Nonferrous Metal; Precious Metal; Silver Alloy; Solder/Braze Alloy

Material Notes: Braze 600 is a copper rich eutectiferous alloy, the eutectiferous portion of which is molten at 1300EF (705EC), about 25EF before the entire composition is completely fluid. Thus to the eye, the alloy would appear to flow at 1300EF.

With this type of alloy, fluidity when brazing copper based metal is decreased, but in the brazing of silver based alloys it is increased. This effect is due to the solution of the base metal.

Both nickel and iron based alloys are readily wet by Braze 600 as it contains 15% zinc.

Applications:Braze 600 is generally used in place of Bag-9 (Braze 650) on silverware where only one joint is required. It is also used as a second joining filler metal in step brazing on an article. It has the same flow point as BAg-9, but the color is slightly more yellow. In a properly made joint, however, the seam should be so narrow that this difference is not noticeable after polishing.

Information provided by Lucas-Milhaupt, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 9.51 g/cc
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 25000 - 30000 psiCopper butt joint
 35000 - 45000 psiBrass butt joint
 55000 - 60000 psiNickel-Silver butt joint
Elongation at Break 13 - 19 %% in 2", Brass butt joint
 20 - 25 %% in 2", Nickel-Silver butt joint
 21 - 27 %% in 2", Copper butt joint
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000840 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Melting Point 1245 - 1325 °F
Solidus 1245 °FMelting Point
Liquidus 1325 °FFlow Point
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 24 - 26 %
Other, total <= 0.15 %
Silver, Ag 59 - 61 %
Zinc, Zn 14 - 16 %
 
Descriptive Properties
ColorWhite
Corrosion Resistance123 Mgs/dcm2/DayConcentrated Hydrofluoric Acid, Room Temperature, Constant Immersion
 35.7 Mgs/dcm2/Day10% Acetic Acid, 205°F, In Vapors
 891 Mgs/dcm2/DayCarbon Tetrachloride, Room Temperature, Presence of Water
 9.3 Mgs/dcm2/Day1% Acetic Acid, 205°F, In Vapors
 NoneWet Ammonia Gas, Room Temperature, Closed Container
 NoneDry Ammonia Gas, Room Temperature, Closed Container

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NLUCMI26 / 18093

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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