Henkel Loctite® ECCOBOND UF 1173 Epoxy

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Henkel Loctite® ECCOBOND UF 1173 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black liquid Cure: Heat cure Product Benefits: One component Void-free underfill Low CTE Long pot life Dissipates stress away from solder joints Application: 2nd Level Underfill LOCTITE ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material has been formulated without any reportable REACH SVHCs (current to June 2018) and the product is not CMR classified. Information provided by Loctite®
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Physical Properties	Metric	English	Comments

Density	1.69 g/cc	0.0611 lb/in³
Viscosity	7500 cP @Shear Rate 10.0 1/s	7500 cP @Shear Rate 10.0 1/s	Uncured, Rheometer AR 1000
Outgassing - Total Mass Loss	0.020 %	0.020 %	CVCM, NASA Outgassing
	0.10 %	0.10 %	WVR, NASA Outgassing
	0.43 %	0.43 %	TML, NASA Outgassing

Mechanical Properties	Metric	English	Comments
Tensile Modulus	6.00 GPa	870 ksi	Storage, Cured, DMA

Thermal Properties	Metric	English	Comments
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	Cured, Below Tg
	103 µm/m-°C	57.2 µin/in-°F	Cured, Above Tg
Glass Transition Temp, Tg	160 °C	320 °F	Cured, by TMA

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
Pot Life	2880 min	2880 min
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Descriptive Properties
Thixotropic Index	0.71		Uncured

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PLOCT5088 / 255299

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