Park Aerospace Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N8000Q Cyanate Ester Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines and spaces and larger panel sizes. Key Features and Benefits: High thermal performance Self adhesive bond to foam cores Superior electrical properties Typical Cyanate Ester processing S-glass and Quartz options Applications: Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers MCM-L's Direct Chip Attach Automotive Underhood Automotive Wireless Communcations High Speed Computing Radomes and Secondary Aerospace Structure Information provided by Park Electrochemical Corp.
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Physical Properties	Original Value	Comments

Density	1.73 g/cc	50% resin content

Mechanical Properties	Original Value	Comments
Modulus of Elasticity	2300 ksi	Y; ASTM D3039
	2600 ksi	X; ASTM D3039
Poissons Ratio	0.16	X; ASTM D3039
	0.16	Y; ASTM D3039
Peel Strength	10.0 pli	1 oz. Cu, after solder float; IPC-TM-650.2.4.8
	10.0 pli	1 oz. Cu, after exposure to process solutions; IPC-TM-650.2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm-cm	E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance	1.00e+13 ohm	C - 96/35/90; IPC-TM-650.2.5.17.1
	1.00e+13 ohm	E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant	3.2 @Frequency 1e+10 Hz	50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
	3.3 @Frequency 1e+9 Hz	50% Resin Content; RF Impedance; IPC-TM-650.2.5.5.9
Dielectric Strength	1500 V/mil	IPC-TM-650.2.5.6.2
Dielectric Breakdown	>= 50000 V	IPC-TM-650.2.5.6
Dissipation Factor	0.0060 @Frequency 1e+10 Hz	50% Resin Content; Stripline; IPC-TM-650.2.5.5.5
Arc Resistance	125 sec	IPC-TM-650.2.5.1

Thermal Properties	Original Value	Comments
CTE, linear	38.9 µin/in-°F @Temperature 50.0 - 250 °C	Z-Axis, Alpha 1; IPC-TM-650.2.4.41
	208 µin/in-°F @Temperature 250 - 260 °C	Z-Axis, Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity	0.2388 BTU/lb-°F	ASTM E1461
Thermal Conductivity	2.36 BTU-in/hr-ft²-°F	Z; ASTM E1461
	3.75 BTU-in/hr-ft²-°F	X-Y; ASTM E1461
Glass Transition Temp, Tg	240 °C	TMA; IPC-TM-650.2.4.24c
	250 °C	DSC; IPC-TM-650.2.4.25c
	300 °C	DMA (Tan d Peak); IPC-TM-650.2.4.24.3

Descriptive Properties
Pressure Cooker	Pass	60 min then solder dip @288°C until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes)	60+	IPC-TM-650.2.4.24.1
T288 (minutes)	30+	IPC-TM-650.2.4.24.1
Z Axis Expansion (%)	2.5	50-260°C; IPC-TM-650.2.4.41

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