Cookson Group Plaskon® SMT-B-2FP Molding Compound for PBGA and CSP

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Cookson Group Plaskon® SMT-B-2FP Molding Compound for PBGA and CSP (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures. Features: Lower moisture pickup Excellent moldability Low wire sweep Fast cure Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.88 g/cc
Moisture Absorption at Equilibrium	0.55 %	at 85°C/85% RH, 168 hours
Viscosity	2500 cP @Temperature 175 °C	Shimadzu Viscosity, 1000 psi
Spiral Flow	160 cm	at 175°C and 1000 psi
Ash	78.5 %
Storage Temperature	<= 5.00 °C	Recommended

Mechanical Properties	Original Value	Comments
Hardness, Shore D	75	Cull hot
Flexural Strength	14220 psi
	2844.7 psi @Temperature 240 °C
Flexural Modulus	1.991e+6 psi
	213400 psi @Temperature 240 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+12 ohm-cm @Temperature 150 °C
	>= 1.00e+15 ohm-cm @Temperature 22.0 °C
Dielectric Constant	4.0 @Frequency 1000 Hz
Dielectric Strength	>= 400 V/mil

Thermal Properties	Original Value	Comments
CTE, linear	18.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	60.0 µm/m-°C @Temperature 20.0 °C	Alpha 2
Thermal Conductivity	0.700 W/m-K
Glass Transition Temp, Tg	195 °C
Flammability, UL94	V-0 @Thickness 3.17 mm

Processing Properties	Original Value	Comments
Mold Temperature	170 - 185 °C
Back Pressure	750 - 1250 psi
Cure Time	70.0 - 120 sec	In mold
	0.000 - 3.00 hour @Temperature 175 °C	Post mold
Gel Time	0.250 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.100 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	at 22°C, <40% loss of spiral flow
	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK014 / 56304

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