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solder replacement adhesives

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In80-Pb15-Ag5 Indium-Lead-Silver Solder
Categories: Metal; Nonferrous Metal; Indium Alloy; Solder/Braze Alloy

Material Notes: Characteristics:
  • Low Melt Temperature
  • Improved thermal fatigue properties when compared with Pb-Sn solders
  • Reduced gold scavenging
  • Wide temperature range allows for two- or three-step soldering

Applications:

  • General soldering
  • Microwire

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Physical PropertiesOriginal ValueComments
Specific Gravity 8.07 g/ccCalculated
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 17.6 MPa
Adhesive Bond Strength 14.8 MPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000130 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Thermal Conductivity 43.0 W/m-K
@Temperature 85.0 °C
Melting Point 143 - 150 °C
Solidus 143 °C
Liquidus 150 °C
 
Component Elements PropertiesOriginal ValueComments
Indium, In 80 %
Lead, Pb 15 %
Silver, Ag 5.0 %
 
Descriptive Properties
ASTM B774(a) Alloy Designation300-302

References for this datasheet.

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MLIND904 / 135518

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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