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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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Lucas-Milhaupt HI-TEMP® 548 Nickel Silver Filler Metal
Categories: Metal; Nonferrous Metal; Copper Alloy; Solder/Braze Alloy

Material Notes: Hi-Temp 548 is a modified nickel silver filler metal primarily used to join tungsten carbide to steel. Brazing is often combined with heat treatment of the steel tool bits. The filler metal has good high temperature strength and toughness. This filler metal exhibits excellent flow and wetting characteristics on tungsten carbides and tool steels, especially when induction brazed. The material also has good gap filling properties and plasticity at brazing temperature while being resistant to the joint cracking tendencies of the standard nickel-silver materials.

Available forms: Wire, strip, engineered preforms, specialty preforms.

Information provided by Lucas-Milhaupt.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 8.12 g/cc
Density 0.293 lb/in³
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000263 ohm-cm6.6% IACS
 
Thermal PropertiesOriginal ValueComments
Melting Point 1615 - 1685 °F
Solidus 1615 °F
Liquidus 1685 °F
 
Processing PropertiesOriginal ValueComments
Processing Temperature 1685 - 1900 °FBrazing Range
 
Component Elements PropertiesOriginal ValueComments
Copper, Cu 54 - 56 %
Manganese, Mn 3.5 - 4.5 %
Nickel, Ni 5.5 - 6.5 %
Other, total <= 0.50 %
Silicon, Si 0.10 - 0.40 %
Zinc, Zn 32.1 - 36.4 %Remainder
 
Descriptive Properties
ColorLight Yellow

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NLUCM9822 / 254768

solder replacement adhesives

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