Indium Corp. 3541 Wave Solder Flux, No-Clean

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RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

Indium Corp. 3541 Wave Solder Flux, No-Clean
Categories:	Fluid; Metal; Nonferrous Metal; Solder/Braze Alloy
Material Notes:	3541 No-Clean is a low-solids flux specially formulated to be used for wave soldering where the cleaning process has been eliminated. This flux contains a small amount of resin which enhances the wetting properties. 3541 No-Clean is activated by a multi-component, synergetic fluxing system, which improves solderability. Any post-soldering residues are considered non-corrosive. 3541 No-clean leaves a "tack-free" surface and does not interfere with ATE testing. Features: Eliminates the need for cleaning Reduces solder ball formation Excellent solderability on standard board finishes and alternative coating Physical Properties Color: Straw J-STD-004 Flux Type: ORL0 Information Provided by Indium Corporation
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Physical Properties	Metric	English	Comments

Specific Gravity	0.800 g/cc @Temperature 25.0 °C	0.800 g/cc @Temperature 77.0 °F
	0.806 g/cc @Temperature 15.5 °C	0.806 g/cc @Temperature 59.9 °F
Solids Content	4.31 %	4.31 %

Chemical Properties	Metric	English	Comments
Acid Value	25	25

Electrical Properties	Metric	English	Comments
Insulation Resistance	1.88e+13 ohm	1.88e+13 ohm	Control - final; Standard Bellcore
	2.68e+13 ohm	2.68e+13 ohm	Control - initial; Standard Bellcore
	3.76e+9 ohm @Time 605000 sec	3.76e+9 ohm @Time 168 hour	Control; IPC B25A
	1.74e+10 ohm @Time 86400 sec	1.74e+10 ohm @Time 24.0 hour	Control; IPC B25A

Thermal Properties	Metric	English	Comments
Flash Point	12.2 °C	54.0 °F	TCC

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Overview of materials for Solder/Braze Alloy

NNIN990 / 131629

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