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Master Bond adhesives

Celanese Hostaform® C 9021 GV3/30 POM, 30% Glass Reinforced
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM); Acetal Copolymer, 30% Glass Fiber Reinforced

Material Notes: Chemical abbreviation according to ISO 1043-1: POM

Information provided by Celanese

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Physical PropertiesMetricEnglishComments
Density 1.59 g/cc0.0574 lb/in³ISO 1183
Density of Compound 1.37 g/cc0.0495 lb/in³
Water Absorption at Saturation 0.90 %0.90 %ISO 62
Melt Flow 7.5 g/10 min
@Load 2.16 kg,
Temperature 190 °C
7.5 g/10 min
@Load 4.76 lb,
Temperature 374 °F
[cm3/10min]; ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 38.0 MPa5510 psi50mm/min; ISO 527-2/1A
Elongation at Break 12 %12 %
Elongation at Yield 6.0 %6.0 %50mm/min; ISO 527-2/1A
Tensile Modulus 3.90 GPa566 ksi50mm/min; ISO 527-2/1A
Flexural Modulus 3.50 GPa508 ksiISO 178
Charpy Impact Unnotched 4.00 J/cm²19.0 ft-lb/in²ISO 179/1eU
 4.00 J/cm²
@Temperature -30.0 °C
19.0 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eU
Charpy Impact, Notched 0.300 J/cm²1.43 ft-lb/in²ISO 179/1eA
 0.300 J/cm²
@Temperature -30.0 °C
1.43 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eA
Tensile Creep Modulus, 1 hour 3300 MPa479000 psiISO 899-1
Tensile Creep Modulus, 1000 hours 2100 MPa305000 psiISO 899-1
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+14 ohm-cm1.00e+14 ohm-cmIEC 60093
Surface Resistance 1.00e+14 ohm1.00e+14 ohmIEC 60093
Dielectric Constant  4.5
@Frequency 1e+6 Hz
4.5
@Frequency 1e+6 Hz
IEC 60250
 5.0
@Frequency 100 Hz
5.0
@Frequency 100 Hz
IEC 60250
Dielectric Strength 40.0 kV/mm1020 kV/inIEC 60243-1
Dissipation Factor  0.0080
@Frequency 1e+6 Hz
0.0080
@Frequency 1e+6 Hz
IEC 60250
 0.030
@Frequency 100 Hz
0.030
@Frequency 100 Hz
IEC 60250
Comparative Tracking Index 600 V600 VIEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 90.0 µm/m-°C50.0 µin/in-°FISO 11359-2
CTE, linear, Transverse to Flow 90.0 µm/m-°C50.0 µin/in-°FISO 11359-2
Specific Heat Capacity 1.78 J/g-°C0.425 BTU/lb-°F
Thermal Conductivity 0.225 W/m-K1.56 BTU-in/hr-ft²-°F
Melting Point 166 °C331 °F10°C/min; ISO 11357-1,-2,-3
Deflection Temperature at 1.8 MPa (264 psi) 112 °C234 °FISO 75-1, -2
Flammability, UL94  HB
@Thickness 1.57 mm
HB
@Thickness 0.0618 in
 HB
@Thickness 0.810 mm
HB
@Thickness 0.0319 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 80.0 - 120 °C176 - 248 °Fcavity
 190 - 210 °C374 - 410 °Fhot runner
Feed Temperature 60.0 - 80.0 °C140 - 176 °F
Zone 1 170 - 180 °C338 - 356 °F
Zone 2 180 - 190 °C356 - 374 °F
Zone 3 190 - 200 °C374 - 392 °F
Zone 4 190 - 210 °C374 - 410 °F
Die Temperature 190 - 210 °C374 - 410 °F
Melt Temperature 190 - 210 °C374 - 410 °F
Ejection Temperature 140 °C284 °F
Drying Temperature 100 - 120 °C212 - 248 °F
Dry Time 3.00 - 4.00 hour3.00 - 4.00 hour
Moisture Content <= 0.15 %<= 0.15 %
Injection Pressure 60.0 - 120 MPa8700 - 17400 psi
Hold Pressure 60.0 - 120 MPa8700 - 17400 psi
Back Pressure <= 2.00 MPa<= 290 psi
Screw Speed  70 rpm
@Diameter 55.0 mm
70 rpm
@Diameter 2.17 in
 100 rpm
@Diameter 40.0 mm
100 rpm
@Diameter 1.57 in
 150 rpm
@Diameter 25.0 mm
150 rpm
@Diameter 0.984 in
 
Descriptive Properties
Eff. thermal diffusivity7.3E-08[m^2/s]
Injection moldingYes
Injection speedslow
Processing conditions acc. ISO9988

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PHCQ354 / 178809

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