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Elmet Technologies

Materion eStainless® 200 25/50/25 H3 Temper Stainless/Copper Laminate
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: eStainless steel is a thermally conductive, fully formable clad laminate of stainless steel and copper (SUS/Cu/SUS). It is ideal as a high-conductivity replacement for stainless steel, allowing heat spreading functionality to be designed directly into the structure of devices. Integrated heatsinks made of eStainless clads reduce the need to add specialty thermal management solutions, saving both costs and internal device space. eStainless steels are typically used in consumer electronics devices to enhance the performance of components such as chassis, frames, EMI shields, brackets, and anywhere else that metals are used.

Information provided by Materion.

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Mechanical PropertiesMetricEnglishComments
Hardness, Vickers >= 320>= 320SUS
Tensile Strength, Ultimate 620 MPa89900 psi
Tensile Strength, Yield 560 MPa
@Strain 0.200 %
81200 psi
@Strain 0.200 %
Elongation at Break 4.00 %4.00 %
Flexural Yield Strength >= 808 MPa>= 117000 psi
Flexural Modulus 0.190 GPa27.6 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000300 ohm-cm0.00000300 ohm-cm
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 31.0 W/m-K215 BTU-in/hr-ft²-°FZ
 200 W/m-K1390 BTU-in/hr-ft²-°FX-Y
 
Descriptive Properties
90° Bend Formability<1.25Longitudinal

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NBB92156 / 323514

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