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Master Bond adhesives

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E-Polymers SEPAZ® C130M 30% Mineral Reinforced LCP Resin
Categories: Polymer; Thermoplastic; Liquid Crystal Polymer (LCP); Liquid Crystal Polymer (LCP), Mineral Filled

Material Notes: Liquid Crystal Polymer Resin: SEPAZ LCP resin has a unique structure and performance unthought of in a traditional plastics. Beside SEPAZ LCP takes the excels in all-around performance and molding productivity. SEPAZ LCP has a unique attribute in that the thinner the product becomes, the greater the mechanical strength. SEPAZ LCP finds uses in connectors, sensors and other electronic components and CD pick-up parts, and in copying machine and fax components in office and audio-visual equipment.

Information Provided by E-Polymers Co., Ltd.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.63 g/ccASTM D792
Linear Mold Shrinkage 0.00 cm/cm
Linear Mold Shrinkage, Transverse 0.0050 cm/cm
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 127.53 MPaASTM D638
Elongation at Break 4.0 %ASTM D638
Flexural Strength 127.53 MPaASTM D790
Flexural Modulus 9613.8 MPaASTM D790
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cmASTM D257
Surface Resistance >= 1.00e+15 ohmASTM D257
Dielectric Constant 3.2
@Frequency 1e+6 Hz
ASTM D150
Dielectric Strength 26.0 kV/mm
@Thickness 1.60 mm
ASTM D149
Dissipation Factor 0.028
@Frequency 1e+6 Hz
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 8.00 µm/m-°C
@Thickness 1.60 mm
ASTM D696
CTE, linear, Transverse to Flow 22.0 µm/m-°C
@Thickness 1.60 mm
ASTM D696
Melting Point 335 °CASTM D789
Deflection Temperature at 1.8 MPa (264 psi) 239 °CASTM D648
Flammability, UL94 V-0
 
Processing PropertiesOriginal ValueComments
Melt Temperature 350 - 360 °C
Mold Temperature 30.0 - 150 °C

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PEPOLZ065 / 103562

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