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Master Bond adhesives

Copper Alloy, UNS C51900, OS015 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Nominal Grain Size 0.015 mm

Excellent Suitability – Soldering, Brazing, Butt Weld, Capacity for Being Cold Worked; Good Suitability – Gas Shielded Arc Welding, Spot Weld; Fair Suitability – Oxyacetylene Welding; Poor Suitability – Coated Metal Arc Welding, Seam Weld, Capacity for Being Hot Formed

Typical Uses: Electrical Connectors; Electrical Flexing Contact Blades; Electronic Connectors

Applicable Specifications: Bar – ASTM B103/B103M; Plate - ASTM B103/B103M; Sheet - ASTM B103/B103M; Strip - ASTM B103/B103M

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Physical PropertiesMetricEnglishComments
Density 8.83 g/cc0.319 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 386 MPa56000 psi
Tensile Strength, Yield 200 MPa29000 psi0.2% Offset
Elongation at Break 45 %45 %
Tensile Modulus 110 GPa16000 ksi
Modulus of Rigidity 41.4 GPa6000 ksi
Poissons Ratio 0.330.33Calculated
Machinability 20 %20 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000123 ohm-cm0.0000123 ohm-cm14% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.0 µm/m-°C
@Temperature 20.0 - 100 °C
10.0 µin/in-°F
@Temperature 68.0 - 212 °F
Specific Heat Capacity 0.377 J/g-°C0.0900 BTU/lb-°F
Thermal Conductivity 5.48 W/m-K38.0 BTU-in/hr-ft²-°F
Melting Point 927 - 1040 °C1700 - 1900 °F
Solidus 927 °C1700 °F
Liquidus 1040 °C1900 °F
Annealing Point 21.1 - 732 °C70.0 - 1350 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 92.2 - 95 %92.2 - 95 %As Balance
Iron, Fe <= 0.10 %<= 0.10 %
Lead, Pb <= 0.050 %<= 0.050 %
Phosphorus, P 0.030 - 0.35 %0.030 - 0.35 %
Tin, Sn 5.0 - 7.0 %5.0 - 7.0 %
Zinc, Zn <= 0.30 %<= 0.30 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC51900y1 / 292149

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