| LORD CoolTherm™ SC-252 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. CoolTherm SC-252 encapsulant can be either room temperature cured or heat cured for maximum adhesion. Features: exhibits low shrinkage and stress on components as it cures. maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials. provides high thermal conductivity for applications where superior heat dissipation is required. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. provides excellent thermal shock resistance. All information provided by Lord. |
