MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  

Master Bond adhesives

Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user friendly system has an easy and convenient one to one mix ratio by weight. EP21LV-LO features outstanding physical strength properties, along with being an excellent electrical insulator. This combination of properties enables it to be readily used as a potting and encapsulation compound. EP21LV-LO resists many chemicals including water, oils, fuels, acids, bases and salts quite well. It bonds well to a variety of substrates including metals, glass, ceramics and many types of rubber and many plastics. To optimize its properties, the best cure schedule is 12-24 hours at room temperature, plus another 2 hours at 150-200°F. Most importantly, EP21LV-LO passes NASA low outgassing specifications. The color of Part A is clear and Part B is amber in color. It is serviceable over the wide temperature range of -60°F to +250°F. This versatile system is widely used in aerospace, microelectronics, semiconductor, optical and vacuum applications.

Product Advantages:

  • Lower viscosity; convenient mixing; ideal for bonding, sealing, coating and encapsulation.
  • Easily applied; adhesive spreads smoothly.
  • High bonding strength to a wide variety of substrates.
  • Excellent adhesion to similar and dissimilar substrates.
  • Good electrical insulation properties.
  • Superior durability, thermal shock and chemical resistance.
  • Passes NASA low outgassing specifications.

Information provided by MasterBond®

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

Click here to view all available suppliers for this material.

Please click here if you are a supplier and would like information on how to add your listing to this material.

 
Physical PropertiesMetricEnglishComments
Viscosity 10000 - 14000 cP10000 - 14000 cPPart A
 11000 - 15000 cP11000 - 15000 cPPart B
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D >= 70>= 70
Tensile Strength at Break >= 51.7 MPa
@Temperature 23.9 °C
>= 7500 psi
@Temperature 75.0 °F
Tensile Modulus 2.07 - 2.41 GPa
@Temperature 23.9 °C
300 - 350 ksi
@Temperature 75.0 °F
Shear Strength >= 19.3 MPa>= 2800 psiAl/Al, bond
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cm
Dielectric Constant 2.79
@Frequency 60 Hz
2.79
@Frequency 60 Hz
Dielectric Strength 17.3 kV/mm
@Thickness 3.17 mm
440 kV/in
@Thickness 0.125 in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 50.0 - 55.0 µm/m-°C27.8 - 30.6 µin/in-°F
Maximum Service Temperature, Air 121 °C250 °F
Minimum Service Temperature, Air -53.9 °C-65.0 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  120 - 180 min
@Temperature 93.3 °C
2.00 - 3.00 hour
@Temperature 200 °F
 720 - 1440 min
@Temperature 23.9 °C
12.0 - 24.0 hour
@Temperature 75.0 °F
plus 2 hrs at 150-200°F
 2880 - 4320 min
@Temperature 23.9 °C
48.0 - 72.0 hour
@Temperature 75.0 °F
Pot Life 60 - 90 min60 - 90 min100 gram mass
Shelf Life 12.0 Month
@Temperature 23.9 °C
12.0 Month
@Temperature 75.0 °F
in original unopened containers
 
Descriptive Properties
Mixing Ratio (A to B)1:1by weight or volume

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Master Bond EP21SC-1 Two Component Epoxy Resin System
Master Bond EP21NDFG Two component epoxy compound for high performance applications
Master Bond EP21TDC-2AN Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin
Master Bond EP21LVSP6 Two component epoxy for bonding, sealing, coating and encapsulating
Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin

PMASTB313 / 149560

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.