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Master Bond adhesives

Copper Alloy, UNS C51980, H08 Temper, Flat Products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Temper: Spring

Excellent Suitability – Soldering, Brazing, Butt Weld, Capacity for Being Cold Worked; Good Suitability – Gas Shielded Arc Welding, Spot Weld; Fair Suitability – Oxyacetylene Welding, Coated Metal Arc Welding, Seam Weld; Poor Suitability – Capacity for Being Hot Formed

Typical Uses: Terminals, automotive; Connectors, Electrical, Lead-Free; Contact springs

Applicable Specifications: Strip - ASTM B888/B88M

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Physical PropertiesMetricEnglishComments
Density 8.83 g/cc0.319 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 848 MPa123000 psi
Tensile Strength, Yield 827 MPa120000 psi0.2% Offset
Elongation at Break 2.0 %2.0 %
Tensile Modulus 110 GPa16000 ksi
Modulus of Rigidity 41.4 GPa6000 ksi
Poissons Ratio 0.330.33Calculated
Machinability 20 %20 %
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.0000123 ohm-cm0.0000123 ohm-cm14% IACS
 
Thermal PropertiesMetricEnglishComments
CTE, linear 18.0 µm/m-°C
@Temperature 20.0 - 300 °C
10.0 µin/in-°F
@Temperature 68.0 - 572 °F
Thermal Conductivity 5.48 W/m-K38.0 BTU-in/hr-ft²-°F
Melting Point 927 - 1040 °C1700 - 1910 °F
Solidus 927 °C1700 °F
Liquidus 1040 °C1910 °F
Annealing Point 371 - 732 °C700 - 1350 °F
 
Component Elements PropertiesMetricEnglishComments
Copper, Cu 91.9 - 94.4 %91.9 - 94.4 %As Balance
Iron, Fe 0.050 - 0.20 %0.050 - 0.20 %
Lead, Pb <= 0.050 %<= 0.050 %
Nickel, Ni 0.050 - 0.20 %0.050 - 0.20 %
Phosphorus, P 0.010 - 0.35 %0.010 - 0.35 %
Tin, Sn 5.5 - 7.0 %5.5 - 7.0 %
Zinc, Zn <= 0.30 %<= 0.30 %
 
Descriptive Properties
US EPA Registered AntimicrobialYes

References for this datasheet.

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MC51980x6 / 292160

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