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Master Bond adhesives

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308 Stainless steel, cold drawn wire, full hardened
Categories: Metal; Ferrous Metal; Heat Resisting; Stainless Steel; T 300 Series Stainless Steel
Key Words: UNS S30800, ASTM A167, ASTM A276, ASTM A314, ASTM A473, ASTM A580, SAE J405 (30308), DIN 1.4303, UNI X 8 CrNi 19 10, JIS SUS 305, JIS SUS 305 J1
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Physical PropertiesOriginal ValueComments
Density 8.00 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 379
@Diameter 3.20 - 9.53 mm		Converted from Rockwell C hardness.
Hardness, Knoop 414
@Diameter 3.20 - 9.53 mm		Converted from Rockwell C hardness.
Hardness, Rockwell C 38 - 43
@Diameter 3.20 - 9.53 mm
Hardness, Vickers 399
@Diameter 3.20 - 9.53 mm		Converted from Rockwell C hardness.
Tensile Strength, Ultimate 1310 - 1515 MPa
@Diameter 3.20 - 9.53 mm
 1310 - 1655 MPa
@Diameter 0.530 - 3.18 mm
 1550 - 1725 MPa
@Diameter 0.0510 - 0.510 mm
Tensile Strength, Yield 1070 - 1275 MPa
@Diameter 3.20 - 9.53 mm
 1240 - 1520 MPa
@Diameter 0.530 - 3.18 mm
 1450 - 1655 MPa
@Diameter 0.0510 - 0.510 mm
Elongation at Break 1.0 - 2.0 %
@Diameter 0.0510 - 0.510 mm		in 50 mm
 2.0 - 5.0 %
@Diameter 0.530 - 3.18 mm		in 50 mm
 2.0 - 5.0 %
@Diameter 3.20 - 9.53 mm		in 50 mm
Tensile Modulus 195 GPa
Izod Impact 135 - 165 J
Charpy Impact >= 135 J
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000720 ohm-cm
@Temperature 20.0 °C
 0.000116 ohm-cm
@Temperature 650 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.3 µm/m-°C
@Temperature 0.000 - 100 °C
 17.8 µm/m-°C
@Temperature 0.000 - 315 °C
 18.4 µm/m-°C
@Temperature 0.000 - 540 °C
 18.7 µm/m-°C
@Temperature 0.000 - 650 °C
Specific Heat Capacity 0.500 J/g-°C
@Temperature 0.000 - 100 °C
Thermal Conductivity 15.2 W/m-K
@Temperature 0.000 - 100 °C
 21.6 W/m-K
@Temperature 500 °C
Melting Point 1400 - 1455 °C
Solidus 1400 °C
Liquidus 1455 °C
Maximum Service Temperature, Air 925 °CIntermittent
 980 °CContinuous Service
 
Component Elements PropertiesOriginal ValueComments
Carbon, C <= 0.080 %
Chromium, Cr 20 %
Iron, Fe 66 %
Manganese, Mn <= 2.0 %
Nickel, Ni 11 %
Phosphorus, P <= 0.045 %
Silicon, Si <= 1.0 %
Sulfur, S <= 0.030 %

References for this datasheet.

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MQ308P / 12705




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