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Master Bond adhesives

Fire-refined Tough Pitch Copper with Silver, UNS C12800, OSO50 Temper wire
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Good to excellent corrosion resistance. Excellent hot and cold workability; good forgeability. Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping.

Applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables and tubes, klystrons, microwave tubes, and rectifiers.

Test specimens: wire - 2mm diameter.

UNS C12800 is inactive per the Copper Development Association. C12500, C12700, C12800, C12900, and C13000 are similar alloys having very similar mechanical properties; they are distinguished by differences in silver content.

Key Words: Fire-Refined Copper, FRTSP. MIL-W-3318
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Physical PropertiesMetricEnglishComments
Density 8.89 g/cc0.321 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Ultimate 240 MPa34800 psi
Elongation at Break 35 %35 %in 250 mm
Modulus of Elasticity 115 GPa16700 ksiEstimated from similar Cu Alloys
Poissons Ratio 0.310.31Calculated
Machinability 20 %20 %UNS C36000 (free-cutting brass) = 100%
Shear Modulus 44.0 GPa6380 ksiEstimated from similar Cu Alloys
Shear Strength 165 MPa23900 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000176 ohm-cm
@Temperature 20.0 °C
0.00000176 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.8 µm/m-°C
@Temperature 20.0 - 100 °C
9.33 µin/in-°F
@Temperature 68.0 - 212 °F
 17.4 µm/m-°C
@Temperature 20.0 - 200 °C
9.67 µin/in-°F
@Temperature 68.0 - 392 °F
 17.7 µm/m-°C
@Temperature 20.0 - 300 °C
9.83 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C0.0920 BTU/lb-°F
Thermal Conductivity 377 W/m-K
@Temperature 20.0 °C
2620 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
Melting Point <= 1085 °C<= 1985 °F
Liquidus 1085 °C1985 °F
 
Processing PropertiesMetricEnglishComments
Annealing Temperature 400 - 650 °C752 - 1200 °F
Hot-Working Temperature 750 - 950 °C1380 - 1740 °F
 
Component Elements PropertiesMetricEnglishComments
Antimony, Sb <= 0.0030 %<= 0.0030 %
Arsenic, As <= 0.012 %<= 0.012 %
Bismuth, Bi <= 0.0030 %<= 0.0030 %
Copper, Cu >= 99.88 %>= 99.88 %Includes Ag
Lead, Pb <= 0.0040 %<= 0.0040 %
Nickel, Ni <= 0.050 %<= 0.050 %
Selenium, Se <= 0.025 %<= 0.025 %includes Te
Silver, Ag >= 0.034 %>= 0.034 %Min 10 troy oz./ton (may be specified)

References for this datasheet.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

MC12800c1 / 148829

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