Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage

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Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound; Filled/Reinforced Thermoset
Material Notes:	Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electric and mechanical properties, very good chemical resistance, low viscosity, UL listed (RTI 155°C). Applications: Encapsulation of electric parts, e. g. electromagnetic coil
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Physical Properties	Original Value	Comments

Density	1.89 g/cc	ISO 1183
Apparent Bulk Density	0.850 g/cc	ISO 60
Linear Mold Shrinkage	0.0025 cm/cm	Compression Molding. Post Shrinkage = 0.01%.; ISO 2577
	0.0030 cm/cm	Injection Molding. Post Shrinkage = 0.02%.; ISO 2577

Mechanical Properties	Original Value	Comments
Ball Indentation Hardness	400 MPa	H961/30; ISO 2039/P1
Tensile Strength	55.0 MPa	ISO 527 - 1/2
Tensile Modulus	13000 MPa	ISO 527 - 1/2
Flexural Strength	125 MPa	ISO 178
Flexural Modulus	15500 MPa	ISO 178
Compressive Strength	170 MPa	ISO 604
Charpy Impact Unnotched	8.50 kJ/m²	ISO 179-1 eU
Charpy Impact, Notched	4.00 kJ/m²	ISO 179-1eA

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm
Surface Resistance	1.00e+12 ohm
Dielectric Constant	5.5 @Frequency 100 Hz
Dielectric Strength	30.0 kV/mm @Thickness 1.00 mm	IEC 60243-P1
Dissipation Factor	0.020 @Frequency 100 Hz
Arc Resistance	192 - 194 sec	ASTM D495
High Voltage Arc Resistance to Ignition (HVAR)	>= 300 sec @Thickness 1.50 mm	BK
Comparative Tracking Index	250 V	IEC 6011
Hot Wire Ignition, HWI	60 - 120 sec @Thickness 1.50 mm	BK
	>= 120 sec @Thickness 3.00 mm	BK
High Amp Arc Ignition, HAI	15 - 30 arcs @Thickness 1.50 mm	BK
	60 - 120 arcs @Thickness 3.00 mm	BK
High Voltage Arc-Tracking Rate, HVTR	0.000 - 10.0 mm/min @Thickness 3.00 mm	BK

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	180 °C	<20000 hours; IEC 60216-P1
	220 °C	< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa	120 °C	ISO 75-2
UL RTI, Electrical	155 °C @Thickness 1.50 mm	BK
UL RTI, Mechanical with Impact	155 °C @Thickness 1.50 mm	BK
UL RTI, Mechanical without Impact	155 °C @Thickness 1.50 mm	BK
Flammability, UL94	HB @Thickness 1.50 mm	BK

Processing Properties	Original Value	Comments
Feed Temperature	60.0 - 75.0 °C	Injection molding
Nozzle Temperature	70.0 - 100 °C	Injection molding
Melt Temperature	90.0 - 100 °C	Injection molding
Mold Temperature	160 - 190 °C	Compression molding
	170 - 190 °C	Injection molding
Injection Pressure	>= 10.0 MPa	Compression and injection cavity mold pressure
Back Pressure	0.500 - 2.00 MPa	Injection molding
Cure Time	15.0 - 25.0 sec	Per 1 mm of wall thickness, injection molding
	30.0 - 60.0 sec	Per 1 mm of wall thickness, compression molding

Descriptive Properties
Chromatic Spectrum	Subdued Colors
Creep Rupture Strength	Very Good
Holding Pressure	Approximately 40-60% of injection pressure
Media Resistance	Very Good
Thermal Expansion	Very Slight
Water absorption (mg)	6	24h / 23°C

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