- Solders directly to aluminum for aluminum to copper and aluminum to aluminum connections
- Eliminating the need for plating aluminum before soldering
- Good thermal stability for heat sink reflow soldering
Description: Superior Solder Paste ASP is a water-soluble formulation designed for direct aluminum to copper soldering of heat sinks. It also has excellent soldering characteristics for copper and nickel-plated aluminum surfaces. The presence of silver in the solder alloy of the paste permits the creation of a true intermetallic bond between the solder and the aluminum.Applications: Superior Solder Paste ASP is made from Type 3 Powder (-325/+500 Mesh Powder) with a unique flux binding system to keep the very active aluminum flux portion of the flux form degrading the solder powder. The material should be refrigerated before use and when in storage. The ideal temperature for printing and dispensing the paste is 20°C – 23°C with a relative humidity of 35-55%. Information provided by Superior Flux |
