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Master Bond adhesives

Cotronics Resbond™ 908 High Temperature Ceramic Adhesive, Moisture Proof  (discontinued **)
Categories: Ceramic

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Mechanical PropertiesMetricEnglishComments
Flexural Strength 7.58 MPa1100 psi
Compressive Strength 20.7 MPa3000 psi
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+10 ohm-cm1.00e+10 ohm-cm
Dielectric Strength 7.87 kV/mm200 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 8.10 µm/m-°C
@Temperature 20.0 °C
4.50 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 2.16 W/m-K15.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 1650 °C3000 °F

**
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Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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CCOTR0070 / 758

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