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Flame Retardant adhesives

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Cookson Group Plaskon® 7060 Conventional Encapsulant  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is a reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs and SOICs. It was especially developed for balanced end use properties.

Features

  • Excellent moldability
  • Superior cosmetics
  • Improved markability
  • Outstanding device reliability

Information provided by Cookson Electronics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.83 g/cc
Viscosity 1300 - 2100 cP
@Temperature 175 °C
Automatic orifice Viscosity
Linear Mold Shrinkage 0.0025 cm/cm
Spiral Flow 97.0 cmat 177°C and 1000 psi
Ash 73 %
Storage Temperature <= 5.00 °CRecommended
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80Cull hot, 90 sec @ 175°C
Flexural Strength 19998 psi
Flexural Modulus 2.199e+6 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.58e+16 ohm-cm
Dielectric Constant 4.0
@Frequency 1000 Hz
Dielectric Strength >= 400 V/mil
Dissipation Factor 0.0050
@Frequency 1000 Hz
Arc Resistance 180 sec110V AC
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 µm/m-°C
@Temperature 20.0 °C
Alpha 1
 65.0 µm/m-°C
@Temperature 20.0 °C
Alpha 2
Thermal Conductivity 0.670 W/m-K
Glass Transition Temp, Tg 155 °C
Flammability, UL94 V-0
@Thickness 3.17 mm
Oxygen Index 30 %
 
Processing PropertiesOriginal ValueComments
Mold Temperature 170 - 190 °C
Back Pressure 750 - 1000 psi
Cure Time 4.00 hour
 4.00 hour
@Temperature 175 °C
Post mold
 60.0 - 120 sec
@Temperature 177 °C
Gel Time 0.333 minRam follower, at 177°C
Shelf Life 0.0670 Monthat 35°C, <40% loss of spiral flow
 0.167 Monthat 21°C, <40% loss of spiral flow
 24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Cl<1 ppm
Preheat Temperature88-99°C

**
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PPLASK024 / 56314

Flame Retardant adhesives

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