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Master Bond adhesives

Bakelite® PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof
Categories: Polymer; Thermoset; Filled/Reinforced Thermoset; Phenolic
Material Notes: Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.

Applications: Fittings for ovens and dishwashers, medium heat resistant cookware fittings.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.50 g/cc0.0542 lb/in³ISO 1183
Apparent Bulk Density 0.700 g/cc0.0253 lb/in³ISO 60
Linear Mold Shrinkage 0.0080 cm/cm0.0080 in/inInjection Molding. Post Shrinkage = 0.45%.; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 55.0 MPa7980 psiISO 527 - 1/2
Tensile Modulus 8.50 GPa1230 ksiISO 527 - 1/2
Flexural Strength 95.0 MPa13800 psiISO 178
Flexural Modulus 8.50 GPa1230 ksiISO 178
Compressive Strength 225 MPa32600 psiISO 604
Charpy Impact Unnotched 0.650 J/cm²3.09 ft-lb/in²ISO 179-1 eU
Charpy Impact, Notched 0.170 J/cm²0.809 ft-lb/in²ISO 179-1eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+12 ohm-cm1.00e+12 ohm-cm
Surface Resistance 1.00e+11 ohm1.00e+11 ohm
Dielectric Constant 12
@Frequency 100 Hz		12
@Frequency 100 Hz
Dissipation Factor 0.30
@Frequency 100 Hz		0.30
@Frequency 100 Hz
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 150 °C302 °F<20000 hours; IEC 60216-P1
 230 °C446 °F< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 120 °C248 °FISO 75-2
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Melt Temperature 80.0 - 100 °C176 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FInjection molding
 160 - 190 °C320 - 374 °FCompression molding
Injection Pressure >= 15.0 MPa>= 2180 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.167 - 0.333 min0.00278 - 0.00556 hourPer 1 mm of wall thickness, injection molding
 0.333 - 0.667 min0.00556 - 0.0111 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumAll Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Thermal ExpansionVery Slight
Water absorption (mg)4524h / 23°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PBAKE016 / 27050




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