Lead-Free Bismuth Alloy, Copper Alloy, UNS C49300, H04 Temper, Rod

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Lead-Free Bismuth Alloy, Copper Alloy, UNS C49300, H04 Temper, Rod
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: Hard Excellent Suitability - Soldering, Capacity for Being Hot Formed; Good Suitability – Brazing; Fair Suitability – Butt Weld; Poor Suitability – Capacity for Being Cold Worked Typical Uses: Cu Alloy based devices for lead-free water applications; Lead-free defined by Calif. AB 1953, max .25% Pb content; Lead-free, dezincification resistant alloy for potable water components; Valves, fittings, pumps, meters Applicable Specifications: Forgings, Die (Hot Pressed) – ASME SB283, ASTM B283/B283M; Rod, Bar & Shapes – Forgings ASTM B124/B124M; Rod, Bar & Wire – ASTM B967/B967M
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Physical Properties	Metric	English	Comments

Density	8.30 g/cc	0.300 lb/in³

Mechanical Properties	Metric	English	Comments
Tensile Strength	517 MPa	75000 psi
Tensile Strength, Yield	414 MPa	60000 psi	0.2% Offset
Elongation at Break	5.0 %	5.0 %
Tensile Modulus	102 GPa	14800 ksi
Modulus of Rigidity	35.2 GPa	5100 ksi
Poissons Ratio	0.45	0.45	Calculated
Machinability	85 %	85 %
Forgeability	95 %	95 %

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.0000112 ohm-cm	0.0000112 ohm-cm	15.4% IACS
Magnetic Permeability	1.0	1.0

Thermal Properties	Metric	English	Comments
CTE, linear	18.2 µm/m-°C @Temperature 20.0 - 100 °C	10.1 µin/in-°F @Temperature 68.0 - 212 °F
	19.8 µm/m-°C @Temperature 20.0 - 200 °C	11.0 µin/in-°F @Temperature 68.0 - 392 °F
	20.9 µm/m-°C @Temperature 20.0 - 300 °C	11.6 µin/in-°F @Temperature 68.0 - 572 °F
Specific Heat Capacity	0.418 J/g-°C	0.100 BTU/lb-°F
Thermal Conductivity	7.35 W/m-K	51.0 BTU-in/hr-ft²-°F
Melting Point	840.0 - 880.0 °C	1544 - 1616 °F
Solidus	840.0 °C	1544 °F
Liquidus	880.0 °C	1616 °F

Component Elements Properties	Metric	English	Comments
Antimony, Sb	<= 0.50 %	<= 0.50 %
Bismuth, Bi	0.50 - 2.5 %	0.50 - 2.5 %
Cadmium, Cd	<= 0.0075 %	<= 0.0075 %
Copper, Cu	58 - 62 %	58 - 62 %
Iron, Fe	<= 0.10 %	<= 0.10 %
Lead, Pb	<= 0.090 %	<= 0.090 %
Nickel, Ni	<= 0.30 %	<= 0.30 %
Selenium, Se	<= 0.20 %	<= 0.20 %
Silicon, Si	<= 0.10 %	<= 0.10 %
Tin, Sn	1.0 - 1.8 %	1.0 - 1.8 %
Zinc, Zn	32.5 - 40.5 %	32.5 - 40.5 %	As Balance

Descriptive Properties
US EPA Registered Antimicrobial	Yes

References for this datasheet.

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MC49300x8 / 292080

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