Lead-Free Bismuth Alloy, Copper Alloy, UNS C49300, H02 Temper, Bar

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Lead-Free Bismuth Alloy, Copper Alloy, UNS C49300, H02 Temper, Bar
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: 1/2 Hard Excellent Suitability - Soldering, Capacity for Being Hot Formed; Good Suitability – Brazing; Fair Suitability – Butt Weld; Poor Suitability – Capacity for Being Cold Worked Typical Uses: Cu Alloy based devices for lead-free water applications; Lead-free defined by Calif. AB 1953, max .25% Pb content; Lead-free, dezincification resistant alloy for potable water components; Valves, fittings, pumps, meters Applicable Specifications: Forgings, Die (Hot Pressed) – ASME SB283, ASTM B283/B283M; Rod, Bar & Shapes – Forgings ASTM B124/B124M; Rod, Bar & Wire – ASTM B967/B967M
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Physical Properties	Original Value	Comments

Density	0.300 lb/in³

Mechanical Properties	Original Value	Comments
Hardness, Vickers	159 @Load 0.500 kg
Tensile Strength	67.0 ksi
Tensile Strength, Yield	59.0 ksi	0.2% Offset
Elongation at Break	9.0 %
Tensile Modulus	14800 ksi
Modulus of Rigidity	5100 ksi
Poissons Ratio	0.45	Calculated
Machinability	85 %
Forgeability	95 %

Electrical Properties	Original Value	Comments
Electrical Resistivity	0.0000112 ohm-cm	15.4% IACS
Magnetic Permeability	1.0

Thermal Properties	Original Value	Comments
CTE, linear	10.1 µin/in-°F @Temperature 20.0 - 100 °C
	11.0 µin/in-°F @Temperature 20.0 - 200 °C
	11.6 µin/in-°F @Temperature 20.0 - 300 °C
Specific Heat Capacity	0.100 BTU/lb-°F
Thermal Conductivity	51.0 BTU-in/hr-ft²-°F
Melting Point	1544 - 1616 °F
Solidus	1544 °F
Liquidus	1616 °F

Component Elements Properties	Original Value	Comments
Antimony, Sb	<= 0.50 %
Bismuth, Bi	0.50 - 2.5 %
Cadmium, Cd	<= 0.0075 %
Copper, Cu	58 - 62 %
Iron, Fe	<= 0.10 %
Lead, Pb	<= 0.090 %
Nickel, Ni	<= 0.30 %
Selenium, Se	<= 0.20 %
Silicon, Si	<= 0.10 %
Tin, Sn	1.0 - 1.8 %
Zinc, Zn	32.5 - 40.5 %	As Balance

Descriptive Properties
US EPA Registered Antimicrobial	Yes

References for this datasheet.

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MC49300x1 / 292073

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