| This epoxy system can achieve flexibility and plasticity without sacrificing adhesive, electrical, structural, and other properties. This compound is a clear (unfilled) basic formulation. Its applications include: bonding, laminating, casting, embedding, electrical potting, impregnating, coating, etc. It can be supplied in several variations to modify viscosity, reaction rate, color, most physical and chemical properties, and with many fillers to meet most requirements. |
