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Master Bond adhesives

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Brush Wellman Beryllium Copper Alloy 165 Strip; XHM (TM06) Temper (UNS C17000)  (discontinued **)
Categories: Metal; Nonferrous Metal; Beryllium Alloy; Copper Alloy

Material Notes: Treatment required for max strength: Mill Hardened
Stress Relaxation-% Stress Remaining after 1000 hrs @ 100°C: 98%
Stress Relaxation after 1000 hrs @ 200°C: 69%
Formability Ratio, 90° Bend, Radius/Thickness (Good Way): 6.1
Formability Ratio (bad Way): 10.4
Superficial Hardness: 30N 52-58

Tabulated properties apply to products after age hardening. Information supplied by Brush Wellman.

Brush Engineered Materials Inc. changed its name to Materion Corporation in March 2011.

Key Words: ASTM B-194, QQ-C-533
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 8.41 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell C 32 - 38
Hardness, Vickers 317 - 378
Tensile Strength, Ultimate 1060 - 1210 MPa
Tensile Strength, Yield 930 - 1140 MPa
Elongation at Break 3.0 - 10 %
Modulus of Elasticity 131 GPa
Fatigue Strength 340 - 390 MPa
@# of Cycles 1.00e+8
Reverse Bending (R=1)
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.00000520 - 0.00000960 ohm-cm18-33% IACS Conductivity
 
Thermal PropertiesOriginal ValueComments
CTE, linear 17.0 µm/m-°C
@Temperature 20.0 - 200 °C
Thermal Conductivity 105 W/m-K
Melting Point 870 - 980 °C
Solidus 870 °C
Liquidus 980 °C
 
Component Elements PropertiesOriginal ValueComments
Beryllium, Be 1.6 - 1.79 %
Co + Ni >= 0.20 %
Co + Ni + Fe <= 0.60 %
Copper, Cu 98 %as balance

**
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NBB472 / 15189

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