Lord Adhesives Metech 1130C Platinum Silver Conductor Composition

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Lord Adhesives Metech 1130C Platinum Silver Conductor Composition
Categories:	Polymer; Adhesive
Material Notes:	This low cost, platinum silver conductor is designed for general hybrid applications. It employs advanced powders technology with a mix bonded frit system to yield a highly dense film that is resistant to solder leaching. It also exhibits excellent adhesion to beryllium oxide substrates. All information provided by Lord.
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Physical Properties	Metric	English	Comments

Brookfield Viscosity	160000 - 220000 cP @Temperature 25.0 °C	160000 - 220000 cP @Temperature 77.0 °F	HBT, Spindle #SC4-14 @ 10rpm
Thickness	11.0 - 13.0 microns	0.433 - 0.512 mil	Fired

Electrical Properties	Metric	English	Comments
Surface Resistivity per Square	<= 0.0025 ohm	<= 0.0025 ohm

Processing Properties	Metric	English	Comments
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Adhesion	3-4		lbs; aged (500hrs. at 150ºC)
	4-5		lbs; initial
Coverage (cm²/gm)	70-75		Calculated from 50 micron wet film
Line Resolution (microns)	125
Solder Leach Resistance (5 sec. cycles)	5		Cycles required to leach 50% of a 10 mil wide conductive line using 62Sn/36Pb/2Ag at 230ºC
Solder Wetting (seconds)	< 3		Time required to 100% solder wet 0.08" x 0.08" pad size using 62Sn/36Pb/2Ag at 230ºC

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PLORD083 / 86091

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