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Metal adhesives

Henkel Loctite® ABLESTIK ABP 8037TI Acrylate
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver paste

Cure: Heat cure

Product Benefits:

  • Excellent electrical conductivity
  • High thermal conductivity
  • Excellent adhesive strength
  • Stable at high temperatures
  • Hydrophobic
Application: Die attach

Filler Type: Silver

Key Substrates:

  • Wide variety of metals and ceramic surfaces
  • Silver Plated Copper
  • Preplated leadframes (NiPdAu)
LOCTITE ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Brookfield Viscosity 11000 cP11000 cPUncured, - HA, Spindle 51, speed 5 rpm
 
Mechanical PropertiesMetricEnglishComments
Tensile Modulus  1.30 GPa
@Temperature 250 °C
189 ksi
@Temperature 482 °F
Cured, Young's
 1.60 GPa
@Temperature 200 °C
232 ksi
@Temperature 392 °F
Cured, Young's
 1.70 GPa
@Temperature 300 °C
247 ksi
@Temperature 572 °F
Cured, Young's
 4.10 GPa
@Temperature 100 °C
595 ksi
@Temperature 212 °F
Cured, Young's
 5.90 GPa
@Temperature 150 °C
856 ksi
@Temperature 302 °F
Cured, Young's
 5.90 GPa
@Temperature 25.0 °C
856 ksi
@Temperature 77.0 °F
Cured, Young's
 8.40 GPa
@Temperature -65.0 °C
1220 ksi
@Temperature -85.0 °F
Cured, Young's
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 0.000060 ohm-cm0.000060 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 62.0 µm/m-°C34.4 µin/in-°FCured, Below Tg
 94.0 µm/m-°C52.2 µin/in-°FCured, Above Tg
Thermal Conductivity 4.10 W/m-K28.5 BTU-in/hr-ft²-°FCured
Glass Transition Temp, Tg 46.0 °C115 °FCured, TMA
 
Processing PropertiesMetricEnglishComments
Cure Time 30.0 min0.500 hourramp to 175ºC, hold 30 minutes @ 175 °C
 30.0 min0.500 hourramp to 150ºC, hold 30 minutes @ 150 °C, Alternate Cure Schedule
Working Life 1440 min1440 min
Shelf Life 12.0 Month
@Temperature -40.0 °C
12.0 Month
@Temperature -40.0 °F
Uncured, from date of manufacture
 
Descriptive Properties
Extractable Ionic Content (ppm)<1Cured, Potassium (K+)
 <10Cured, Chloride (Cl-)
 <20Cured, Sodium (Na+)
Shear Strength17.5 kgDie, 120 x 120 mil Si die on PPF LF @ 25°C
 17.6 kgDie, 120 x 120 mil Ag/Cu LF @ 25°C
 6.9 kgDie, 120 x 120 mil Si die on PPF LF @ 270°C
 7.4 kgDie, 120 x 120 mil Ag/Cu LF @ 270°C
Thixotropic Index2.8Uncured, 0.5/5 rpm

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PLOCT5040 / 255251

Metal adhesives

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