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Specialty Compounds RTP Company

Chase Electronic Coatings HumiSeal® 1B31-HV Acrylic Conformal Coating
Categories: Polymer; Thermoset

Material Notes: HumiSeal® 1B31-HV conformal coating is: an acrylic chemistry fast drying single component. HumiSeal 1B31-HV conformal coating has: excellent moisture and environmental protection for printed circuit assemblies, excellent flexibility, fluorescence under UV light for ease of inspection, rework ability with ease, higher viscosity for dipping and brushing applications. RoHS Directive 2002/95/EC compliance.

Information provided by Chase Electronic Coatings.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 0.920 g/cc0.0332 lb/in³ASTM D1475
Solids Content 41.5 %41.5 %± 2%. By weight; Fed-Std-141, Meth. 4044
Volatile Organic Compounds (VOC) Content 523 g/l523 g/l
Viscosity 400 - 440 cP400 - 440 cPFed-Std-141, Meth. 4287
Thickness 25.0 - 75.0 microns0.984 - 2.95 milRecommended coating
 
Mechanical PropertiesMetricEnglishComments
Modulus of Elasticity  0.00850 GPa
@Temperature 60.0 °C
1.23 ksi
@Temperature 140 °F
DMA
 1.05 GPa
@Temperature 20.0 °C
152 ksi
@Temperature 68.0 °F
DMA
 2.00 GPa
@Temperature -40.0 °C
290 ksi
@Temperature -40.0 °F
DMA
 
Electrical PropertiesMetricEnglishComments
Insulation Resistance 6.00e+10 ohm6.00e+10 ohmMoisture; MIL-I-46058C
 8.00e+14 ohm8.00e+14 ohmMIL-I-46058C
Dielectric Constant 2.5
@Frequency 1e+6 Hz,
Temperature 25.0 °C
2.5
@Frequency 1e+6 Hz,
Temperature 77.0 °F
ASTM D150-98
Dielectric Breakdown 7500 V7500 VASTM D149
Dissipation Factor 0.010
@Frequency 1e+6 Hz,
Temperature 25.0 °C
0.010
@Frequency 1e+6 Hz,
Temperature 77.0 °F
ASTM D150-98
 
Thermal PropertiesMetricEnglishComments
CTE, linear  170 µm/m-°C
@Temperature <=14.0 °C
94.4 µin/in-°F
@Temperature <=57.2 °F
Below Tg; TMA
 340 µm/m-°C
@Temperature >=14.0 °C
189 µin/in-°F
@Temperature >=57.2 °F
Above Tg; TMA
Glass Transition Temp, Tg 14.0 °C57.2 °FDSC
 
Processing PropertiesMetricEnglishComments
Cure Time  30.0 min
@Temperature 76.0 °C
0.500 hour
@Temperature 169 °F
Option
 1440 min
@Temperature 23.0 °C
24.0 hour
@Temperature 73.4 °F
Option
 10100 min
@Temperature 23.0 °C
168 hour
@Temperature 73.4 °F
Optimum Properties
Tack-Free Time 10.2 min0.170 hourTo handle; Fed-Std-141, Meth. 4061
Shelf Life 24.0 Month
@Temperature 23.0 °C
24.0 Month
@Temperature 73.4 °F
DOM
 
Descriptive Properties
Dielectric Withstand>1500 Vper MIL_I_46058C
Fungus ResistancePassesASTM G21
Thermal Shock-65 to 125°Cper MIL_I_46058C, 50 cycles

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