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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Covestro Makrolon® 2458 Polycarbonate, Injection Grade
Categories: Polymer; Thermoplastic; Polycarbonate (PC); Polycarbonate, Unreinforced, Flame Retardant

Material Notes: MVR (300 °C/1.2 kg) 19 cm³/10 min; medical devices; suitable for ETO and steam sterilization at 121°C; biocompatible according to many ISO 10993-1 test requirements; low viscosity; easy release; injection molding - melt temperature 280 - 320 °C; available in transparent and opaque colors

As of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and officially adopted its new name – Covestro.

Key Words: PC
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Bulk Density 0.660 g/cc0.0238 lb/in³Pellets; ISO 60
Density 1.20 g/cc0.0434 lb/in³ISO 1183
Moisture Absorption at Equilibrium 0.12 %0.12 %50% RH; ISO 62
Water Absorption at Saturation 0.30 %0.30 %ISO 62
Linear Mold Shrinkage 0.0050 - 0.0070 cm/cm0.0050 - 0.0070 in/inparallel/normal; b.o. ISO 2577
Linear Mold Shrinkage, Flow 0.0065 cm/cm0.0065 in/in60x60x2 mm; 500 bar; ISO 294-4
Linear Mold Shrinkage, Transverse 0.0070 cm/cm0.0070 in/in60x60x2 mm; 500 bar; ISO 294-4
Melt Flow 20 g/10 min
@Load 1.20 kg,
Temperature 300 °C
20 g/10 min
@Load 2.65 lb,
Temperature 572 °F
ISO 1133
 
Mechanical PropertiesMetricEnglishComments
Puncture Resistance  5100 N
@Temperature 23.0 °C
1150 lb (f)
@Temperature 73.4 °F
ISO 6603-2
 6000 N
@Temperature -30.0 °C
1350 lb (f)
@Temperature -22.0 °F
ISO 6603-2
Ball Indentation Hardness 115 MPa16700 psiISO 2039-1
Tensile Strength at Break 70.0 MPa10200 psi50 mm/min; ISO 527-1,-2
Tensile Strength, Yield 65.0 MPa9430 psi50 mm/min; ISO 527-1,-2
Elongation at Break >= 50 %>= 50 %Nominal, 50 mm/min; ISO 527-1,-2
 130 %130 %50 mm/min; b.o. ISO 527-1,-2
Elongation at Yield 6.1 %6.1 %50 mm/min; ISO 527-1,-2
Tensile Modulus 2.40 GPa348 ksi50 mm/min; ISO 527-1,-2
Flexural Strength 97.0 MPa14100 psi2 mm/min; ISO 178
Flexural Yield Strength 73.0 MPa10600 psiat 3.5% strain; ISO 178
Flexural Modulus 2.35 GPa341 ksiISO 178
Flexural Strain at Yield 7.1 %7.1 %2 mm/min; ISO 178
Izod Impact, Notched (ISO)  15.0 kJ/m²
@Thickness 3.00 mm,
Temperature -30.0 °C
7.14 ft-lb/in²
@Thickness 0.118 in,
Temperature -22.0 °F
ISO 7391/b.o. ISO 180-A
 65.0 kJ/m²
@Thickness 3.00 mm,
Temperature 23.0 °C
30.9 ft-lb/in²
@Thickness 0.118 in,
Temperature 73.4 °F
ISO 7391/b.o. ISO 180-A
Charpy Impact Unnotched  NB
@Temperature 23.0 °C
NB
@Temperature 73.4 °F
ISO 179-1eU
 NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
ISO 179-1eU
 NB
@Temperature -60.0 °C
NB
@Temperature -76.0 °F
ISO 179-1eU
Charpy Impact, Notched  1.40 J/cm²
@Thickness 3.00 mm,
Temperature -30.0 °C
6.66 ft-lb/in²
@Thickness 0.118 in,
Temperature -22.0 °F
ISO 7391/b.o. ISO 179-1eA
 6.50 J/cm²
@Thickness 3.00 mm,
Temperature 23.0 °C
30.9 ft-lb/in²
@Thickness 0.118 in,
Temperature 73.4 °F
ISO 7391/b.o. ISO 179-1eA
Puncture Energy  55.0 J
@Temperature 23.0 °C
40.6 ft-lb
@Temperature 73.4 °F
ISO 6603-2
 65.0 J
@Temperature -30.0 °C
47.9 ft-lb
@Temperature -22.0 °F
ISO 6603-2
Tensile Creep Modulus, 1 hour 2200 MPa319000 psiISO 899-1
Tensile Creep Modulus, 1000 hours 1900 MPa276000 psiISO 899-1
 
Electrical PropertiesMetricEnglishComments
Surface Resistance 1.00e+16 ohm1.00e+16 ohmIEC 60093
Dielectric Constant  3.0
@Frequency 1e+6 Hz
3.0
@Frequency 1e+6 Hz
IEC 60250
 3.1
@Frequency 100 Hz
3.1
@Frequency 100 Hz
IEC 60250
Dielectric Strength 34.0 kV/mm864 kV/in1 mm; IEC 60243-1
Dissipation Factor  0.00050
@Frequency 100 Hz
0.00050
@Frequency 100 Hz
IEC 60250
 0.0090
@Frequency 1e+6 Hz
0.0090
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 250 V250 VSolution A; IEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 65.0 µm/m-°C
@Temperature 23.0 - 55.0 °C
36.1 µin/in-°F
@Temperature 73.4 - 131 °F
ISO 11359-1,-2
CTE, linear, Transverse to Flow 65.0 µm/m-°C
@Temperature 23.0 - 55.0 °C
36.1 µin/in-°F
@Temperature 73.4 - 131 °F
ISO 11359-1,-2
Specific Heat Capacity 1.17 J/g-°C0.280 BTU/lb-°FASTM D2766
Thermal Conductivity 0.200 W/m-K1.39 BTU-in/hr-ft²-°FISO 8302
Hot Ball Pressure Test 138 °C280 °FIEC 60695-10-2
Deflection Temperature at 0.46 MPa (66 psi) 139 °C282 °FISO 75-1,-2
Deflection Temperature at 1.8 MPa (264 psi) 125 °C257 °FISO 75-1,-2
Vicat Softening Point 145 °C293 °F50 N, 50°C/h; ISO 306
 145 °C
@Load 5.10 kg
293 °F
@Load 11.2 lb
120°C/h; ISO 306
Glass Transition Temp, Tg 146 °C295 °FISO 11357-1,-2
Flash Point 480 °C896 °Fignition; ASTM D1929
 550 °C1020 °Fself ignition; ASTM D1929
Oxygen Index 28 %28 %Method A; ISO 4589-2
 
Optical PropertiesMetricEnglishComments
Refractive Index 1.5861.586Procedure A; ISO 489
Haze <= 0.80 %
@Thickness 3.00 mm
<= 0.80 %
@Thickness 0.118 in
ISO 14782
Transmission, Visible  87 %
@Thickness 4.00 mm
87 %
@Thickness 0.157 in
ISO 13468-2
 88 %
@Thickness 3.00 mm
88 %
@Thickness 0.118 in
ISO 13468-2
 89 %
@Thickness 1.00 mm
89 %
@Thickness 0.0394 in
ISO 13468-2
 89 %
@Thickness 2.00 mm
89 %
@Thickness 0.0787 in
ISO 13468-2
 
Processing PropertiesMetricEnglishComments
Melt Temperature 280 °C536 °FInjection; ISO 294
Mold Temperature 80.0 °C176 °FInjection; ISO 294
Injection Velocity 200 mm/sec7.87 in/secISO 294

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PBA431 / 26932

USP Class VI adhesives

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